DSPIC30F2010-20I/SP Microchip Technology, DSPIC30F2010-20I/SP Datasheet - Page 177

• Manufacturer Part Number: DSPIC30F2010-20I/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010-20I/SP

• Program Memory Type: FLASH
• Program Memory Size: 12KB (4K x 24)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 20
• Data Ram Size: 512 B
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 1024 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F2010-20I/SPG; DSPIC30F201020ISG; DSPIC30F201020ISG; DSPIC30F201020ISP

FIGURE 22-19:
 2004 Microchip Technology Inc.
Note: Refer to Figure 22-2 for load conditions.
(CKP = 0)
(CKP = 1)
SDI
SDI
SS
SCK
SCK
SDO
X
X
X
X
X
SP60
SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS
SP50
SP40
MSb IN
SP71
MSb
SP41
SP30,SP31
SP70
SP52
BIT14 - - - - - -1
BIT14 - - - -1
Preliminary
SP35
SP20
SP20
LSb
LSb IN
SP21
SP21
dsPIC30F2010
SP52
SP51
DS70118D-page 175