P89V52X2FA,512 NXP Semiconductors, P89V52X2FA,512 Datasheet - Page 42

• Manufacturer Part Number: P89V52X2FA,512
• Description: IC 80C51 MCU FLASH 8K 44-PLCC
• Manufacturer: NXP Semiconductors
• Series: 89Vr

Specifications of P89V52X2FA,512

• Program Memory Type: FLASH
• Program Memory Size: 8KB (8K x 8)
• Package / Case: 44-PLCC
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number Of I /o: 32
• Eeprom Size: 192 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: P89V5x
• Core: 80C51
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11011 - BOARD FOR P89V52X2 44-TQFP622-1017 - BOARD 44-ZIF PLCC SOCKET622-1012 - BOARD FOR P89V52X2 44-TQFP622-1008 - BOARD FOR LPC9103 10-HVSON622-1002 - USB IN-CIRCUIT PROG LPC9XX
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4249-5; 935282528512; P89V52X2FA

NXP Semiconductors
7. Limiting values
Table 43.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
otherwise noted.
8. Static characteristics
Table 44.
T
P89V52X2_3
Product data sheet
Symbol
T
T
V
I
P
Symbol
n
t
I
V
V
V
V
I
I
I
OL(I/O)
ret(fl)
latch
IL
THL
LI
amb
endu(fl)
amb(bias)
stg
n
tot(pack)
IL
IH
OL
OH
= 40 C to +85 C; V
Limiting values
Static characteristics
Parameter
endurance of flash
memory
flash memory
retention time
I/O latch-up current JEDEC Standard 78
LOW-level input
voltage
HIGH-level input
voltage
LOW-level output
voltage
HIGH-level output
voltage
LOW-level input
current
HIGH-LOW
transition current
input leakage
current
Parameter
bias ambient temperature
storage temperature
voltage on any other pin
LOW-level output current per
input/output pin
total power dissipation (per package) based on package heat
DD
= 2.7 V to 5.5 V; V
Conditions
JEDEC Standard A117
JEDEC Standard A103
V
V
V
V
Bus mode, ALE, PSEN
V
V
0.45 V < V
0
DD
DD
DD
DD
I
I
I
I
I
I
= 0.4 V, ports 1, 2, 3
= 2 V, ports 1, 2, 3
OL
OH
OH
OH
= 4.5 V
= 2.7 V, ports 1, 2, 3
= 4.5 V, ports 1, 2, 3
= 4.5 V, Port 0 in External
= 3.2 mA
= 20 A
= 30 A
= 3.2 mA
I
< V
SS
DD
= 0 V
Rev. 03 — 4 May 2009
Conditions
except V
V
transfer, not device power
consumption
0.3 V, port
DD
SS
, with respect to
[2][3][4]
[1]
[1]
[1]
[5]
[5]
[6]
80C51 with 256 B RAM, 192 B data EEPROM
Min
10000
100
100 + I
0.7V
-
V
V
V
-
-
0.5
1
DD
DD
DD
DD
0.7
0.7
0.7
DD
Min
-
-
55
65
0.5
Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Max
0.3V
6.0
0.4
-
-
-
50
650
10
P89V52X2
Max
+125
+150
V
15
1.5
DD
© NXP B.V. 2009. All rights reserved.
DD
+ 0.5
SS
Unit
cycles
years
mA
V
V
V
V
V
V
Unit
V
mA
W
42 of 57
unless
A
A
A
C
C