STM8S105C4B3 STMICROELECTRONICS [STMicroelectronics], STM8S105C4B3 Datasheet - Page 115

• Manufacturer Part Number: STM8S105C4B3
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM8S105xx
11.3
Thermal characteristics
The maximum chip junction temperature (T
Operating conditions
The maximum chip-junction temperature, T
the following equation:
T
Where:
•
•
•
•
•
Dim.
Symbol
e
eA
eB
L
(1)
Θ
Θ
Jmax
JA
JA
T
Θ
P
P
power.
P
+ Σ((V
and high level in the application.
Values in inches are converted from mm and rounded to 4 decimal digits
Amax
I/Omax
Dmax
INTmax
JA
= T
is the package junction-to-ambient thermal resistance in ° C/W
Amax
is the maximum ambient temperature in °C
DD
is the sum of P
represents the maximum power dissipation on output pinsWhere:P
is the product of I
-V
mm
Min
OH)
2.540
+ (P
Parameter
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 44 - 10 x 10 mm
*I
Dmax
OH
), taking into account the actual V
x Θ
INTmax
Table 58: Thermal characteristics
JA
Typ
DD
1.778
10.160
3.048
)
andV
DocID14771 Rev 9
and P
DD
I/Omax
, expressed in Watts. This is the maximum chip internal
Max
12.700
3.810
Jmax
J max
(P
Dmax
, in degrees Celsius, may be calculated using
) must never exceed the values given in
= P
INTmax
inches
Min
OL
0.1000
/I
OL and
+ P
(1)
(1)
I/Omax
V
Value
57
54
Package characteristics
OH
Typ
/I
0.0700
0.4000
0.1200
)
OH
of the I/Os at low
I/Omax
=Σ (V
Max
0.5000
0.1500
Unit
°C/W
°C/W
115/127
OL
*I
OL
)