STM8S105C4B3 STMICROELECTRONICS [STMicroelectronics], STM8S105C4B3 Datasheet - Page 111

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STM8S105C4B3

Manufacturer Part Number
STM8S105C4B3
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
STM8S105xx
11.2.4
32-lead VFQFPN package mechanical data
Dim.
A
A1
A3
b
D
Table 55: 32-lead very thin fine pitch quad flat no-lead package mechanical data
Note:
1. The exposed pad must be soldered to the PCB. It is recommended to connect it to
VSS.
Figure 50: 32-lead very thin fine pitch quad flat no-lead package (5 x 5)
mm
Min
0.80
0
0.18
4.85
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
Typ
0.90
0.02
0.20
0.25
5.00
b
8
DocID14771 Rev 9
1
32
9
e
Bottom view
Max
1.00
0.05
0.30
5.15
D2
D
16
L
17
24
inches
Min
0.0315
0.0071
0.1909
L
A1
E
A
(1)
Package characteristics
ddd C
Typ
0.0354
0.0008
0.0079
0.0098
0.1969
42_ME
Max
0.0394
0.0020
0.0118
0.2028
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