mpc5644a Freescale Semiconductor, Inc, mpc5644a Datasheet - Page 74

• Manufacturer Part Number: mpc5644a
• Description: Mpc5644a Microcontroller Data Sheet
• Manufacturer: Freescale Semiconductor, Inc

Electrical characteristics
3.3
74
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
R
Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
R
R
R
R
R
JCtop

JMA
JMA
All functional non-supply I/O pins are clamped to V
AC signal overshoot and undershoot of up to 2.0 V of the input voltages is permitted for an accumulative
duration of 60 hours over the complete lifetime of the device (injection current not limited for this duration).
Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
supplies, if the maximum injection current specification is met (2 mA for all pins) and V
operating voltage specifications.
Internal structures hold the input voltage less than the maximum voltage on all pads powered by V
if the maximum injection current specification is met (2 mA for all pins) and V
specifications.
Total injection current for all pins (including both digital and analog) must not exceed 25 mA.
Total injection current for all analog input pins must not exceed 15 mA.
Lifetime operation at these specification limits is not guaranteed.
Solder profile per IPC/JEDEC J-STD-020D.
Moisture sensitivity per JEDEC test method A112.
JA
JA
JB
Symbol
JT
Thermal characteristics
CC
CC
CC
CC
CC
CC
CC
C
D Junction-to-Ambient, Natural Convection
D Junction-to-Ambient, Natural Convection
D Junction-to-Moving-Air, Ambient
D Junction-to-Moving-Air, Ambient
D Junction-to-Board
D Junction-to-Case
D Junction-to-Package Top, Natural
Convection
Table 9. Thermal characteristics for 176-pin QFP
Preliminary—Subject to Change Without Notice
MPC5644A Microcontroller Data Sheet, Rev. 4
5
Parameter
4
3
SS
2
2
and V
DDE
2
2
, or V
Single layer board - 1s
Four layer board - 2s2p
@200 ft./min., single layer
board - 1s
@200 ft./min., four layer
board - 2s2p
DDEH
Conditions
.
DDE
is within the operating voltage
1
DDEH
Freescale Semiconductor
is within the
Value
38
31
30
25
20
DDE
5
2
DDEH
supplies,
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit