MSC8101ADS Freescale Semiconductor / Motorola, MSC8101ADS Datasheet - Page 42

• Manufacturer Part Number: MSC8101ADS
• Description: MSC8101 APP DEV SYSTEM
• Manufacturer: Freescale Semiconductor / Motorola

Physical and Electrical Specifications
2.2 Recommended Operating Conditions
Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2.3 Thermal Characteristics
Table 2-3 describes thermal characteristics of the MSC8101.
See Section 4.1, Thermal Design Considerations, on page 4-1 for details on these characteristics.
2-2
Junction-to-ambient, single-layer board
Junction-to-ambient, four-layer board
Junction-to-board
Junction-to-case
Notes:
SC140 core supply voltage
PLL supply voltage
I/O supply voltage
Input voltage
Operating temperature range
1.
2.
3.
4.
5.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface without thermal grease. TBD = to be determined. If a thin (less
than 50 micron) thermal grease interface is established to a heat sink from the lid, the junction to sink thermal resistance is
about 0.7 °C/W.
4
Characteristic
3
Rating
1, 3
Table 2-2.
1, 2
Table 2-3.
MSC8101 Technical Data, Rev. 19
Recommended Operating Conditions
R
R
R
R
Symbol
θJA
θJA
θJB
θJC
Thermal Characteristics
or θ
or θ
or θ
or θ
Symbol
V
V
CCSYN
V
V
DDH
T
JA
JA
JB
JC
DD
IN
J
Natural Convection
0.8
50
22
15
Lidded FC-PBGA
250/275 MHz: –40 to 105
250/275 MHz: 1.5 to 1.7
250/275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
300 MHz: 1.55 to 1.7
300 MHz: –40 to 75
17
–0.2 to V
3.135 to 3.465
×
17 mm
Value
DDH
(1 m/s) airflow
200 ft/min
+ 0.2
37
18
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
Unit
Unit
°C
°C
V
V
V
V
V
V