MSC8101ADS Freescale Semiconductor / Motorola, MSC8101ADS Datasheet - Page 2

• Manufacturer Part Number: MSC8101ADS
• Description: MSC8101 APP DEV SYSTEM
• Manufacturer: Freescale Semiconductor / Motorola

Table of Contents
Chapter 1
Chapter 2
Chapter 3
Chapter 4
Ordering and Contact Information ...............................................................................................................................Back Cover
Data Sheet Conventions
ii
pin and pin-
out
OVERBAR
“asserted”
“deasserted”
Examples:
Note: Values for V
MSC8101 Features .................................................................................................................................................................................... iii
Target Applications .....................................................................................................................................................................................iv
Product Documentation ..............................................................................................................................................................................iv
Signals/Connections
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Physical and Electrical Specifications
2.1
2.2
2.3
2.4
2.5
2.6
Packaging
3.1
3.2
Design Considerations
4.1
4.2
4.3
4.4
Although the device package does not have pins, the term pins and pin-out are used for
convenience and indicate specific signal locations within the ball-grid array.
Used to indicate a signal that is active when pulled low (For example, the
when low.)
Means that a high true (active high) signal is high or that a low true (active low) signal is low
Means that a high true (active high) signal is low or that a low true (active low) signal is high
Signal/Symbol
IL
, V
Power Signals ........................................................................................................................................................................ 1-4
Clock Signals ......................................................................................................................................................................... 1-4
Reset, Configuration, and EOnCE Event Signals.................................................................................................................. 1-5
System Bus, HDI16, and Interrupt Signals............................................................................................................................ 1-6
Memory Controller Signals ................................................................................................................................................. 1-13
CPM Ports............................................................................................................................................................................ 1-15
JTAG Test Access Port Signals............................................................................................................................................ 1-36
Reserved Signals.................................................................................................................................................................. 1-36
Absolute Maximum Ratings .................................................................................................................................................. 2-1
Recommended Operating Conditions .................................................................................................................................... 2-2
Thermal Characteristics ......................................................................................................................................................... 2-2
DC Electrical Characteristics................................................................................................................................................. 2-3
Clock Configuration .............................................................................................................................................................. 2-4
AC Timings............................................................................................................................................................................ 2-7
FC-PBGA Package Description............................................................................................................................................. 3-1
Lidded FC-PBGA Package Mechanical Drawing ............................................................................................................... 3-31
Thermal Design Considerations............................................................................................................................................. 4-1
Electrical Design Considerations........................................................................................................................................... 4-1
Power Considerations ............................................................................................................................................................ 4-2
Layout Practices..................................................................................................................................................................... 4-3
PIN
PIN
PIN
PIN
OL
, V
IH
, and V
MSC8101 Technical Data, Rev. 19
OH
are defined by individual product specifications.
Logic State
False
False
True
True
Signal State
Deasserted
Deasserted
Asserted
Asserted
Freescale Semiconductor
RESET
V
V
V
V
Voltage
pin is active
IH
IH
IL
IL
/V
/V
/V
/V
OL
OH
OH
OL