MT48LC16M16A2P-7E:D Micron Technology Inc, MT48LC16M16A2P-7E:D Datasheet - Page 70

SDRAM 256MB, SMD, 48LC16, TSOP54

MT48LC16M16A2P-7E:D

Manufacturer Part Number
MT48LC16M16A2P-7E:D
Description
SDRAM 256MB, SMD, 48LC16, TSOP54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r

Specifications of MT48LC16M16A2P-7E:D

Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Package / Case
TSOP
Memory Type
DRAM - Synchronous
Memory Configuration
4 BLK (4M X 16)
Interface Type
LVTTL
Rohs Compliant
Yes
Format - Memory
RAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT48LC16M16A2P-7E:D
Manufacturer:
MICRON
Quantity:
5 520
Part Number:
MT48LC16M16A2P-7E:D
Manufacturer:
MT
Quantity:
1 000
Part Number:
MT48LC16M16A2P-7E:D
Manufacturer:
MICRON
Quantity:
8 000
Part Number:
MT48LC16M16A2P-7E:D TR
Manufacturer:
MICRON
Quantity:
11 200
Part Number:
MT48LC16M16A2P-7E:D TR
Manufacturer:
AVAGO
Quantity:
6 700
Figure 55:
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. M 10/07 EN
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
6.40
54-Ball VFBGA “F4/B4” Package, 8mm x 8mm
0.10 C
BALL A9
3.20
Notes:
0.65 ±0.05
C
1. All dimensions in millimeters.
2. Recommended pad = Ø 0.40mm SMD.
3.20
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
70
4.00 ±0.05
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS:
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3% Ag, 0.5% Cu
Ø0.40
64Mb: x4, x8, x16 SDRAM
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.
BALL A1 ID

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