MT48LC16M16A2P-7E:D Micron Technology Inc, MT48LC16M16A2P-7E:D Datasheet - Page 27

SDRAM 256MB, SMD, 48LC16, TSOP54

MT48LC16M16A2P-7E:D

Manufacturer Part Number
MT48LC16M16A2P-7E:D
Description
SDRAM 256MB, SMD, 48LC16, TSOP54
Manufacturer
Micron Technology Inc
Type
SDRAMr
Series
-r

Specifications of MT48LC16M16A2P-7E:D

Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
5.4ns
Maximum Clock Rate
143MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Access Time
RoHS Compliant
Memory Case Style
TSOP
No. Of Pins
54
Operating Temperature Range
0°C To +70°C
Operating Temperature Max
70°C
Operating Temperature Min
0°C
Package / Case
TSOP
Memory Type
DRAM - Synchronous
Memory Configuration
4 BLK (4M X 16)
Interface Type
LVTTL
Rohs Compliant
Yes
Format - Memory
RAM
Memory Size
256M (16Mx16)
Speed
133MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Lead Free Status / RoHS Status
Compliant
Lead Free Status / RoHS Status
Compliant

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Figure 17:
WRITEs
PDF: 09005aef80725c0b/Source: 09005aef806fc13c
64MSDRAM_2.fm - Rev. M 10/07 EN
Terminating a READ Burst
Note:
COMMAND
WRITE bursts are initiated with a WRITE command, as shown in Figure 18 on page 28.
The starting column and bank addresses are provided with the WRITE command, and
auto precharge is either enabled or disabled for that access. If auto precharge is enabled,
the row being accessed is precharged at the completion of the burst. For the generic
WRITE commands used in the following illustrations, auto precharge is disabled.
During WRITE bursts, the first valid data-in element will be registered coincident with
the WRITE command. Subsequent data elements will be registered on each successive
positive clock edge. Upon completion of a fixed-length burst, assuming no other
commands have been initiated, the DQs will remain High-Z, and any additional input
data will be ignored (see Figure 19 on page 28). A full-page burst will continue until
terminated. (At the end of the page, it will wrap to column 0 and continue.)
Data for any WRITE burst may be truncated with a subsequent WRITE command, and
data for a fixed-length WRITE burst may be immediately followed by data for a WRITE
command. The new WRITE command can be issued on any clock following the previous
WRITE command, and the data provided coincident with the new command applies to
the new command.
COMMAND
ADDRESS
ADDRESS
DQM is LOW.
CLK
CLK
DQ
DQ
BANK a,
BANK a,
T0
COL n
COL n
T0
READ
READ
CL = 2
T1
T1
NOP
NOP
CL = 3
T2
T2
NOP
NOP
27
D
OUT
n
T3
T3
NOP
NOP
D
n + 1
D
OUT
OUT
n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
TRANSITIONING DATA
PRECHARGE
PRECHARGE
(a or all)
(a or all)
BANK
BANK
T4
T4
X = 1 cycle
n + 2
D
n + 1
D
OUT
OUT
X = 2 cycles
T5
T5
NOP
NOP
n + 2
n + 3
D
D
OUT
OUT
t RP
t RP
64Mb: x4, x8, x16 SDRAM
T6
T6
NOP
NOP
n + 3
D
OUT
©2000 Micron Technology, Inc. All rights reserved.
DON’T CARE
BANK a,
BANK a,
ACTIVE
ACTIVE
T7
T7
ROW
ROW
Commands

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