PIC32MX210F016B-I/SO Microchip Technology, PIC32MX210F016B-I/SO Datasheet - Page 249

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PIC32MX210F016B-I/SO

Manufacturer Part Number
PIC32MX210F016B-I/SO
Description
PIC32, 16KB Flash, 4KB RAM, 40 MHz, USB, CTMU, 4 DMA 28 SOIC .300in TUBE
Manufacturer
Microchip Technology
Datasheet
TABLE 29-7:
© 2011-2012 Microchip Technology Inc.
DC CHARACTERISTICS
Power-Down Current (I
DC40k
DC40l
DC40n
DC40m
Module Differential Current
DC41e
DC42e
DC43d
Note 1:
Param.
No.
2:
3:
4:
Typical
Base I
disabled. All I/Os are configured as inputs and pulled low. WDT and FSCM are disabled.
Data in the “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base I
Test conditions for ADC module differential current are as follows: Internal ADC RC oscillator enabled.
1000
168
335
10
44
23
5
(2)
PD
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
is measured with all peripheral modules and clocks shut down (ON = 0, PMDx = 1), CPU clock is
Max.
1100
259
536
PD
16
70
20
50
) (Note 1)
PD
Standard Operating Conditions: 2.3V to 3.6V (unless otherwise stated)
Operating temperature
current.
Units
μA
μA
μA
µA
μA
μA
μA
+105ºC
+25°C
+85°C
-40°C
3.6V
3.6V
3.6V
Preliminary
-40°C ≤ T
-40°C ≤ T
Base Power-Down Current
Watchdog Timer Current: ΔI
RTCC + Timer1 w/32 kHz Crystal: ΔI
ADC: ΔI
A
A
≤ +85°C for Industrial
≤ +105°C for V-temp
ADC
Conditions
(Notes 3,4)
PIC32MX1XX/2XX
PD
)
WDT
(Note 3)
DS61168D-page 249
RTCC
(Note 3)

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