A2F500M3G-FGG256 Actel, A2F500M3G-FGG256 Datasheet - Page 6

FPGA - Field Programmable Gate Array 500K System Gates

A2F500M3G-FGG256

Manufacturer Part Number
A2F500M3G-FGG256
Description
FPGA - Field Programmable Gate Array 500K System Gates
Manufacturer
Actel
Datasheet

Specifications of A2F500M3G-FGG256

Processor Series
A2F500
Core
ARM Cortex M3
Number Of Logic Blocks
24
Maximum Operating Frequency
100 MHz
Number Of Programmable I/os
117
Data Ram Size
64 KB
Delay Time
50 ns
Supply Voltage (max)
3.6 V
Supply Current
2 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
Mounting Style
SMD/SMT
Supply Voltage (min)
1.5 V
Number Of Gates
500000
Package / Case
FPBGA-256
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
A2F500M3G-FGG256
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A2F500M3G-FGG256
Manufacturer:
ALTERA
0
Company:
Part Number:
A2F500M3G-FGG256
Quantity:
1 060
Part Number:
A2F500M3G-FGG256I
Manufacturer:
Microsemi SoC
Quantity:
10 000
Part Number:
A2F500M3G-FGG256I
Manufacturer:
MICROSEMI/美高森美
Quantity:
20 000
SmartFusion Intelligent Mixed Signal FPGAs
Product Ordering Codes
Note:
Temperature Grade Offerings
SmartFusion Devices
PQ208
CS288
FG256
FG484
Notes:
1. C = Commercial Temperature Range: 0°C to 85°C Junction
2. I = Industrial Temperature Range: –40°C to 100°C Junction
A2F200
V I
*Most devices in the SmartFusion family can be ordered with the Y suffix. Devices with a package size greater or equal to 5x5
mm are supported. Contact your local Microsemi SoC Products Group sales representative for more information.
Part Number
SmartFusion Devices
A2F060 =
A2F200 =
A2F500 =
M3
CPU Type
M3 = Cortex-M3
60,000 System Gates
200,000 System Gates
500,000 System Gates
F
eNVM Size
_
A = 8 Kbytes
B = 16 Kbytes
C = 32 Kbytes
D = 64 Kbytes
E = 128 Kbytes
F = 256 Kbytes
G = 512 Kbytes
1
Blank
Speed Grade
–1 = 100 MHz MSS Speed; FPGA Fabric 15% Faster than Standard
= 80 MHz MSS Speed; FPGA Fabric at Standard Speed
FG
Package Type
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
CS = Chip Scale Package (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
A2F060
G
C, I
C, I
Lead-Free Packaging Options
R ev i si o n 6
Blank = Standard Packaging
484
G = RoHS-Compliant (green) Packaging
H = Halogen-Free Packaging
Package Lead Count
208
256
288
484
Y
Security Feature*
Y = Device Includes License to Implement IP Based on the
A2F200
Cryptography Research, Inc. (CRI) Patent Portfolio
I
C, I
C, I
C, I
C, I
Application (junction temperature range)
Blank = Commercial (0 to +85°C)
ES = Engineering Silicon (room temperature only)
I = Industrial (–40 to +100°C)
A2F500
C, I
C, I
C, I
C, I

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