DSP56F803BU80 Freescale Semiconductor, DSP56F803BU80 Datasheet - Page 46
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DSP56F803BU80
Manufacturer Part Number
DSP56F803BU80
Description
IC DSP 80MHZ 31.5K FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet
1.DSP56F803BU80E.pdf
(52 pages)
Specifications of DSP56F803BU80
Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
16
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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3.14 JTAG Timing
46
TCK frequency of operation
TCK cycle time
TCK clock pulse width
TMS, TDI data set-up time
TMS, TDI data hold time
TCK low to TDO data valid
TCK low to TDO tri-state
TRST assertion time
DE assertion time
Operating Conditions:
1. Timing is both wait state and frequency dependent. For the values listed, T = clock cycle. For 80MHz
operation, T = 12.5ns.
2. TCK frequency of operation must be less than 1/8 the processor rate.
3. Parameters listed are guaranteed by design.
(Input)
TCK
V
M
= V
IL
+ (V
Characteristic
IH
Figure 3-28 Test Clock Input Timing Diagram
– V
2
V
IL
SS
)/2
V
= V
IH
SSA
Table 3-18 JTAG Timing
= 0 V, V
56F803 Technical Data, Rev. 16
DD
t
PW
= V
V
V
M
IL
DDA
= 3.0–3.6 V, T
Symbol
t
t
CY
TRST
t
f
t
t
t
t
t
t
PW
OP
DH
CY
DS
DV
TS
DE
A
1, 3
= –40° to +85°C, C
t
PW
Min
100
DC
0.4
1.2
V
50
50
4T
—
—
M
L
Max
26.6
23.5
≤
10
—
—
—
—
—
—
Freescale Semiconductor
50pF, f
OP
= 80MHz
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns