DSP56F803BU80 Freescale Semiconductor, DSP56F803BU80 Datasheet - Page 19
![IC DSP 80MHZ 31.5K FLASH 100LQFP](/photos/6/77/67768/375-100-lqfp_sml.jpg)
DSP56F803BU80
Manufacturer Part Number
DSP56F803BU80
Description
IC DSP 80MHZ 31.5K FLASH 100LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxr
Datasheet
1.DSP56F803BU80E.pdf
(52 pages)
Specifications of DSP56F803BU80
Core Processor
56800
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
16
Program Memory Size
71KB (35.5K x 16)
Program Memory Type
FLASH
Ram Size
2.5K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSP56F803BU80
Manufacturer:
MOTOLOLA
Quantity:
996
Company:
Part Number:
DSP56F803BU80
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
DSP56F803BU80
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
DSP56F803BU803
Manufacturer:
FREESCAL
Quantity:
329
Company:
Part Number:
DSP56F803BU80E
Manufacturer:
SHARP
Quantity:
5 600
Company:
Part Number:
DSP56F803BU80E
Manufacturer:
FREESCAL
Quantity:
364
Company:
Part Number:
DSP56F803BU80E
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
DSP56F803BU80E
Manufacturer:
FREESCALE
Quantity:
20 000
Notes:
Freescale Semiconductor
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Junction to center of case
Voltage difference V
ADC reference voltage
Ambient operating temperature
1.
2.
3.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
Junction to ambient thermal resistance, Theta-JA (R
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
Junction to case thermal resistance, Theta-JC (R
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
Characteristic
Characteristic
SS
to V
Table 3-2 Recommended Operating Conditions
SSA
Table 3-3 Thermal Characteristics
Four layer board (2s2p)
Four layer board (2s2p)
Comments
56F803 Technical Data, Rev. 16
θJC
Symbol
VREF
ΔV
T
), was simulated to be equivalent to the measured values
A
SS
θJA
) was simulated to be equivalent to the JEDEC
Symbol
P
R
R
(2s2p)
R
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJA
θJC
JT
I/O
D
Min
-0.1
–40
2.7
P
D
User Determined
= (I
(TJ - TA) /R
100-pin LQFP
6
Typ
DD
–
–
-
Value
41.7
37.2
34.2
10.2
0.8
x V
32
DD
θ
+ P
JA
V
Max
I/O
0.1
85
DDA
)
General Characteristics
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Unit
°C
V
V
Notes
4, 5
1,2
1,2
2
2
3
7
19