PIC18F2320-I/SO Microchip Technology, PIC18F2320-I/SO Datasheet - Page 21

IC MCU FLASH 4KX16 EEPROM 28SOIC

PIC18F2320-I/SO

Manufacturer Part Number
PIC18F2320-I/SO
Description
IC MCU FLASH 4KX16 EEPROM 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F2320-I/SO

Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI, I2C, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
2 x 8 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Package
28SOIC W
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
 Details
2.0
2.1
The PIC18F2X20 and PIC18F4X20 devices can be
operated in ten different oscillator modes. The user can
program the Configuration bits, FOSC3:FOSC0, in
Configuration Register 1H to select one of these ten
modes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. ECIO
2.2
In XT, LP, HS or HSPLL Oscillator modes, a crystal or
ceramic resonator is connected to the OSC1 and
OSC2 pins to establish oscillation. Figure 2-1 shows
the pin connections.
The oscillator design requires the use of a parallel cut
crystal.
© 2007 Microchip Technology Inc.
Note:
LP
XT
HS
HSPLL
RC
RCIO
INTIO1
INTIO2
EC
OSCILLATOR
CONFIGURATIONS
Oscillator Types
Crystal Oscillator/Ceramic
Resonators
Use of a series cut crystal may give a fre-
quency out of the crystal manufacturers
specifications.
F
Low-Power Crystal
Crystal/Resonator
High-Speed Crystal/Resonator
High-Speed Crystal/Resonator
with PLL Enabled
External Resistor/Capacitor with
External Resistor/Capacitor with
Internal Oscillator with F
Output on RA6 and I/O on RA7
Internal Oscillator with I/O on RA6
and RA7
External Clock with F
External Clock with I/O on RA6
I/O on RA6
OSC
/4 Output on RA6
OSC
/4 Output
PIC18F2220/2320/4220/4320
OSC
/4
FIGURE 2-1:
TABLE 2-1:
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values are not optimized.
Different capacitor values may be required to produce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
V
See the notes on page 20 for additional information.
Note 1:
DD
Mode
HS
XT
and temperature range for the application.
C1
C2
2:
3:
455 kHz
2.0 MHz
(1)
(1)
Typical Capacitor Values Used:
See Table 2-1 and Table 2-2 for initial values
of C1 and C2.
A series resistor (R
strip cut crystals.
R
16.0 MHz
F
455 kHz
2.0 MHz
4.0 MHz
8.0 MHz
XTAL
R
varies with the oscillator mode chosen.
Freq
S
Resonators Used:
(2)
CAPACITOR SELECTION FOR
CERAMIC RESONATORS
OSC2
OSC1
16.0 MHz
CRYSTAL/CERAMIC
RESONATOR OPERATION
(XT, LP, HS OR HSPLL
CONFIGURATION)
S
R
OSC1
56 pF
47 pF
33 pF
27 pF
22 pF
) may be required for AT
F (3)
4.0 MHz
8.0 MHz
DS39599G-page 19
PIC18FXXXX
Sleep
To
OSC2
56 pF
47 pF
33 pF
27 pF
22 pF
Internal
Logic

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