EVAL-AD7706EB Analog Devices Inc, EVAL-AD7706EB Datasheet - Page 5

BOARD EVAL FOR AD7706

EVAL-AD7706EB

Manufacturer Part Number
EVAL-AD7706EB
Description
BOARD EVAL FOR AD7706
Manufacturer
Analog Devices Inc
Datasheet

Specifications of EVAL-AD7706EB

Number Of Adc's
1
Number Of Bits
16
Sampling Rate (per Second)
500
Data Interface
Serial
Inputs Per Adc
3 Differential
Input Range
0 ~ 5.25 V
Power (typ) @ Conditions
6.5mW @ 500SPS
Voltage Supply Source
Single
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
AD7706
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Model
AD7705BN
AD7705BR
AD7705BRU
EVAL-AD7705EB
AD7706BN
AD7706BR
AD7706BRU
EVAL-AD7706EB
ABSOLUTE MAXIMUM RATINGS*
(T
V
Analog Input Voltage to GND . . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . . –0.3 V to V
Digital Input Voltage to GND . . . . . . . . –0.3 V to V
Digital Output Voltage to GND . . . . . . –0.3 V to V
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65 C to +150 C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
REV. A
DD
A
Commercial (B Version) . . . . . . . . . . . . . . –40 C to +85 C
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260 C
JA
= +25 C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 105 C/W
V
Supply
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
2.7 V to 5.25 V
DD
DD
DD
DD
DD
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Evaluation Board
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
Evaluation Board
–5–
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4000 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220 C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 139 C/W
Package
Description
Plastic DIP
SOIC
TSSOP
Plastic DIP
SOIC
TSSOP
AD7705/AD7706
Package
Options
N-16
R-16
RU-16
N-16
R-16
RU-16

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