TOOLSTICK560DC Silicon Laboratories Inc, TOOLSTICK560DC Datasheet - Page 31

• Manufacturer Part Number: TOOLSTICK560DC
• Description: DAUGHTER CARD TOOLSTICK F560
• Manufacturer: Silicon Laboratories Inc
• Series: ToolStickr
• Type: MCUr

Specifications of TOOLSTICK560DC

• Contents: Daughter Card
• Processor To Be Evaluated: C8051F55x, C8051F56x, C8051F57x
• Interface Type: USB
• Operating Supply Voltage: 2.7 V to 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F55x, C8051F56x, C8051F57x
• For Use With: 336-1345 - TOOLSTICK BASE ADAPTER336-1182 - ADAPTER USB DEBUG FOR C8051FXXX
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1719

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
E
Table 4.4. QFP-32 Landing Diagram Dimensions
8.40
8.40
Min
Figure 4.4. QFP-32 Landing Diagram
0.80 BSC
Max
8.50
8.50
Rev. 1.1
Dimension
X1
Y1
C8051F55x/56x/57x
0.40
1.25
Min
Max
0.50
1.35
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