SI7703EDN-T1 Vishay/Siliconix, SI7703EDN-T1 Datasheet - Page 11

• Manufacturer Part Number: SI7703EDN-T1
• Description: MOSFET 20V 6.3A 2.8W
• Manufacturer: Vishay/Siliconix

Specifications of SI7703EDN-T1

• Product Category: MOSFET
• Transistor Polarity: P-Channel
• Drain-source Breakdown Voltage: 20 V
• Gate-source Breakdown Voltage: +/- 12 V
• Continuous Drain Current: 4.3 A
• Resistance Drain-source Rds (on): 48 mOms
• Configuration: Single
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: PowerPAK 1212-8
• Fall Time: 6 ns
• Minimum Operating Temperature: - 55 C
• Power Dissipation: 1.3 W
• Rise Time: 6 ns
• Factory Pack Quantity: 3000
• Tradename: TrenchFET
• Typical Turn-off Delay Time: 23 ns

AN822
Vishay Siliconix
CONCLUSIONS
As a derivative of the PowerPAK SO-8, the PowerPAK
1212-8 uses the same packaging technology and has
been shown to have the same level of thermal perfor-
mance while having a footprint that is more than 40 %
smaller than the standard TSSOP-8.
Recommended PowerPAK 1212-8 land patterns are
provided to aid in PC board layout for designs using this
new package.
www.vishay.com
4
105
95
85
75
65
55
45
0.00
Figure 5. Spreading Copper - Si7401DN
0 %
0.25
Spreading Copper (sq. in.)
0.50
0.75
1.00
100 %
1.25
1.50
1.75
50 %
2.00
The PowerPAK 1212-8 combines small size with attrac-
tive thermal characteristics. By minimizing the thermal
rise above the board temperature, PowerPAK simplifies
thermal design considerations, allows the device to run
cooler, keeps r
handle more current than a same- or larger-size MOS-
FET die in the standard TSSOP-8 or SO-8 packages.
Figure 6. Spreading Copper - Junction-to-Ambient Performance
130
120
110
100
90
80
70
60
50
0.00
Spreading Copper (sq. in.)
0.25
DS(ON)
0.50
50 %
low, and permits the device to
0.75
1.00
100 %
1.25
Document Number 71681
1.50
1.75
03-Mar-06
0 %
2.00