NDS9400A_D87Z Fairchild Semiconductor, NDS9400A_D87Z Datasheet - Page 6

• Manufacturer Part Number: NDS9400A_D87Z
• Description: MOSFET Single P-Ch FET Enhancement Mode
• Manufacturer: Fairchild Semiconductor

Specifications of NDS9400A_D87Z

• Transistor Polarity: P-Channel
• Drain-source Breakdown Voltage: - 30 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 3.4 A
• Resistance Drain-source Rds (on): 0.13 Ohms
• Configuration: Single Quad Drain Triple Source
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8 Narrow
• Fall Time: 8 ns
• Minimum Operating Temperature: - 55 C
• Power Dissipation: 2.5 W
• Rise Time: 21 ns
• Typical Turn-off Delay Time: 21 ns

Typical Thermal Characteristics
Figure 12. SO-8 Dual Package Maximum
2.5
1.5
0.5
0.03
0.01
0.3
0.1
2
1
3 0
1 0
0
3
1
0.1
Figure 14. Maximum Safe Operating Area.
1c
Steady-State Power Dissipation versus
Copper Mounting Pad Area.
1 b
0 .0 0 5
0 .0 0 2
0 .0 0 1
0 .0 5
0 .0 2
0 .0 1
R
0 .5
0 .2
0 .1
0 .0001
1
SINGLE PULSE
0.2
J A
V
T
GS
= See Note 1c
A
0.2
2oz COPPER MOUNTING PAD AREA (in
= 25°C
= -10V
- V
0.5
DS
D = 0.5
, DRAIN-SOURCE VOLTAGE (V)
0.2
Figure 15. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
0.1
0.4
1
0.05
0 .001
0.02
0.01
depending on the circuit board design.
Single Pulse
2
0.6
5
4.5"x5" FR-4 Board
T
Still Air
A
0 .0 1
1 0
= 2 5 C
0.8
2
)
o
3 0
1a
5 0
1
t , TIME (sec)
0 .1
1
5
4
3
2
1
Figure 13. Maximum Steady- State Drain
0
1c
1 b
Current versus Copper Mounting Pad
Area.
.
0.2
1
2oz COPPER MOUNTING PAD AREA (in
0.4
P(pk)
T - T
Duty Cycle, D = t
1 0
R
J
R
JA
t
1
A
JA
0.6
(t) = r(t) * R
t
= P * R
2
= See Note 1c
4.5"x5" FR-4 Board
T
Still Air
V
A
G S
= 2 5 C
JA
1
= - 1 0 V
/ t
2
0.8
o
)
JA
(t)
1 0 0
2
3 0 0
NDS9400A.SAM
1a
1