LPC1317FHN33,551 NXP Semiconductors, LPC1317FHN33,551 Datasheet - Page 3

• Manufacturer Part Number: LPC1317FHN33,551
• Description: ARM Microcontrollers - MCU 32bit ARM Cortex-M3 64KB Flash 10KB SRAM
• Manufacturer: NXP Semiconductors

Specifications of LPC1317FHN33,551

• Rohs: yes
• Core: ARM Cortex M3
• Processor Series: LPC1317
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 72 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 260

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
LPC1315_16_17_45_46_47
Product data sheet
Type number
LPC1345FHN33
LPC1345FBD48
LPC1346FHN33
LPC1346FBD48
LPC1347FHN33
LPC1347FBD48
LPC1347FBD64
LPC1315FHN33
LPC1315FBD48
LPC1316FHN33
LPC1316FBD48
LPC1317FHN33
LPC1317FBD48
LPC1317FBD64
Ordering information
Package
Name
HVQFN33
LQFP48
HVQFN33
LQFP48
HVQFN33
LQFP48
LQFP64
LQFP48
LQFP48
LQFP48
HVQFN33
HVQFN33
HVQFN33
LQFP64







Unique device serial number for identification.
Single 3.3 V power supply (2.0 V to 3.6 V).
Temperature range 40 C to +85 C.
Available as LQFP64, LQFP48, and HVQFN33 package.
Consumer peripherals
Medical
Industrial control





Processor wake-up from Deep-sleep and Power-down modes via reset, selectable
GPIO pins, watchdog interrupt, or USB port activity.
Processor wake-up from Deep power-down mode using one special function pin.
Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, Power-down, and Deep power-down modes.
Power-On Reset (POR).
Brownout detect with up to four separate thresholds for interrupt and forced reset.
Description
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
LQFP64: plastic low profile quad flat package; 64 leads; body 10  10 
1.4 mm
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
body 7  7  0.85 mm
plastic low profile quad flat package; 48 leads; body 7  7  1.4 mm
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
plastic thermal enhanced very thin quad flat package; no leads; 33 terminals;
LQFP64: plastic low profile quad flat package; 64 leads; body 10  10 
1.4 mm
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 20 September 2012
LPC1315/16/17/45/46/47


Handheld scanners
USB audio devices
32-bit ARM Cortex-M3 microcontroller
© NXP B.V. 2012. All rights reserved.
Version
n/a
SOT313-2
n/a
SOT313-2
n/a
SOT313-2
SOT314-2
n/a
SOT313-2
n/a
SOT313-2
n/a
SOT313-2
SOT314-2
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