C8051F966-A-GQ Silicon Labs, C8051F966-A-GQ Datasheet - Page 137
C8051F966-A-GQ
Manufacturer Part Number
C8051F966-A-GQ
Description
8-bit Microcontrollers - MCU 32KB DC-DC LCD AES
Manufacturer
Silicon Labs
Datasheet
1.C8051F960-A-GQ.pdf
(492 pages)
Specifications of C8051F966-A-GQ
Rohs
yes
Core
8051
Processor Series
C8051
Data Bus Width
8 bit
Maximum Clock Frequency
24.5 MHz
Program Memory Size
32 KB
Data Ram Size
8 KB
On-chip Adc
Yes
Operating Supply Voltage
1.8 V to 3.8 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
QFP-80
Mounting Style
SMD/SMT
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C8051F96x
10.6. Timing
The timing parameters of the External Memory Interface can be configured to enable connection to
devices having different setup and hold time requirements. The Address Setup time, Address Hold time,
RD and WR strobe widths, and in multiplexed mode, the width of the ALE pulse are all programmable in
units of SYSCLK periods through EMI0TC, shown in SFR Definition 10.3, and EMI0CF[1:0].
The timing for an off-chip MOVX instruction can be calculated by adding 4 SYSCLK cycles to the timing
parameters defined by the EMI0TC register. Assuming non-multiplexed operation, the minimum execution
time for an off-chip XRAM operation is 5 SYSCLK cycles (1 SYSCLK for RD or WR pulse + 4 SYSCLKs).
For multiplexed operations, the Address Latch Enable signal will require a minimum of 2 additional SYS-
CLK cycles. Therefore, the minimum execution time for an off-chip XRAM operation in multiplexed mode is
7 SYSCLK cycles (2 for /ALE + 1 for RD or WR + 4). The programmable setup and hold times default to
the maximum delay settings after a reset. Table 10.2 lists the ac parameters for the External Memory Inter-
face, and Figure 10.4 through Figure 10.9 show the timing diagrams for the different External Memory
Interface modes and MOVX operations.
Rev. 0.5
137
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