ST7FL15F1MAE STMICROELECTRONICS [STMicroelectronics], ST7FL15F1MAE Datasheet - Page 124

• Manufacturer Part Number: ST7FL15F1MAE
• Description: 8-bit MCU for automotive with single voltage Flash/ROM memory, data EEPROM, ADC, 5 timers, SPI
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ST7L15, ST7L19
14 PACKAGE CHARACTERISTICS
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a lead-free second level in-
terconnect. The category of second level intercon-
nect is marked on the package and on the inner
box label, in compliance with JEDEC Standard
14.1 PACKAGE MECHANICAL DATA
Figure 101. 20-Pin Plastic Small Outline Package, 300-mil Width
Table 23. Thermal Characteristics
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
the chip internal power (I
tion.
124/138
R
T
P
Jmax
Dmax
thJA
Symbol
D
B
Package thermal resistance (junction to ambient)
Maximum junction temperature
Power dissipation
DD
e
x V
DD
) and P
A1
E H
A
2)
PORT
Ratings
a
is the port power dissipation depending on the ports used in the applica-
L
1)
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at www.st.com.
h x 45×
D
= (T
J
-T
c
A
) / R
Dim.
A1
A
B
C
D
E
H
h
α
L
N
e
thJA
12.60
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
Min
0°
.
D
= P
1.27
mm
Typ
< 350
Value
150
70
INT
Number of Pins
13.00 0.496
10.65 0.394
Max
2.65 0.093
0.30 0.004
0.51 0.013
0.32 0.009
7.60 0.291
0.75 0.010
1.27 0.016
8°
+ P
20
PORT
Min
0°
, where P
inches
0.050
Typ
°C/W
Unit
mW
°C
0.104
0.012
0.020
0.013
0.512
0.299
0.419
0.030
0.050
Max
8°
INT
is