ADSP-BF537 AD [Analog Devices], ADSP-BF537 Datasheet - Page 66

• Manufacturer Part Number: ADSP-BF537
• Description: Blackfin Embedded Processor
• Manufacturer: AD [Analog Devices]

ADSP-BF534/ADSP-BF536/ADSP-BF537
SURFACE MOUNT DESIGN
The following table is provided as an aide to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
ORDERING GUIDE
1
2
3
Package
182-Ball Mini-BGA (BC-182)
208-Ball Sparse Mini-BGA (BC-208-2)
Model
ADSP-BF534BBC-4A
ADSP-BF534BBCZ-4A
ADSP-BF534BBC-5A
ADSP-BF534BBCZ-5A
ADSP-BF534BBCZ-4B
ADSP-BF534BBCZ-5B
ADSP-BF534YBCZ-4B
ADSP-BF534WYBCZ-4B
ADSP-BF534WBBCZ-4A
ADSP-BF534WBBCZ-4B
ADSP-BF534WBBCZ-5B
ADSP-BF536BBC-3A
ADSP-BF536BBCZ-3A
ADSP-BF536BBC-4A
ADSP-BF536BBCZ-4A
ADSP-BF536BBCZ-3B
ADSP-BF536BBCZ-4B
ADSP-BF537BBC-5A
ADSP-BF537BBCZ-5A
ADSP-BF537KBC-6A
ADSP-BF537KBCZ-6A
ADSP-BF537BBCZ-5B
ADSP-BF537KBCZ-6B
Referenced temperature is ambient temperature.
Z = Pb-free part.
The W in the model number signifies that a version of this product is available for use in automotive applications. Contact your local ADI sales office for complete ordering
information.
2
2
2
2
2
2
2
2
2
2
2
2
2
2, 3
2, 3
2, 3
2, 3
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +105 C
–40 C to +105 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
0 C to 70 C
–40 C to +85 C
0 C to 70 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
0 C to 70 C
1
Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Speed Grade
(Max)
400 MHz
400 MHz
500 MHz
500 MHz
400 MHz
500 MHz
400 MHz
400 MHz
400 MHz
400 MHz
500 MHz
300 MHz
300 MHz
400 MHz
400 MHz
300 MHz
400 MHz
500 MHz
500 MHz
600 MHz
600 MHz
500 MHz
600 MHz
Rev. B | Page 66 of 68 | July 2006
Operating Voltage (Nominal)
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.2 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
1.26 V internal, 2.5 V or 3.3 V I/O
Solder Mask Opening
0.40 mm diameter
0.40 mm diameter
Package Description
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
182-Ball Mini-BGA
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
182-Ball Mini-BGA
208-Ball Sparse Mini-BGA BC-208-2
208-Ball Sparse Mini-BGA BC-208-2
Ball Pad Size
0.55 mm diameter
0.55 mm diameter
Package
Option
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182
BC-182