CY7C1480BV33_11 CYPRESS [Cypress Semiconductor], CY7C1480BV33_11 Datasheet - Page 23

• Manufacturer Part Number: CY7C1480BV33_11
• Description: 72-Mbit (2 M x 36/4 M x 18/1 M x 72) Pipelined Sync SRAM
• Manufacturer: CYPRESS [Cypress Semiconductor]

Electrical Characteristics
Over the Operating Range
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Document Number: 001-15145 Rev. *F
I
I
I
C
C
C
C
C
Parameter
Parameter
Parameter
SB2
SB3
SB4
ADDRESS
DATA
CTRL
CLK
I/O
θ
θ
JC
JA
Address input capacitance
Data input capacitance
Control input capacitance
Clock input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Automatic CE power-down
current—CMOS inputs
Automatic CE power-down
current—CMOS inputs
Automatic CE power-down
current—TTL inputs
Description
Description
Description
[11, 12]
(continued)
V
V
V
≤ 0.3 V or V
f = f
V
V
T
V
V
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance,
according to EIA/JESD51.
A
DD
IN
DD
DD
IN
DD
DDQ
= 25 °C, f = 1 MHz,
≤ 0.3 V or V
MAX
≥ V
= Max, device deselected, or V
= Max, device deselected,
= Max, device deselected,
= 3.3 V
CY7C1480BV33, CY7C1482BV33, CY7C1486BV33
= 2.5 V
Test Conditions
Test Conditions
IH
= 1/t
or V
IN
CYC
IN
> V
IN
≤ V
> V
DDQ
IL
DDQ
, f = 0
Test Conditions
– 0.3 V,
– 0.3 V, f = 0
100-pin TQFP
100-pin TQFP
Package
IN
24.63
Max
2.28
All speeds
All speeds
4.0 ns cycle, 250 MHz
5.0 ns cycle, 200 MHz
6.0 ns cycle, 167 MHz
8
6
5
6
5
165-ball FBGA
165-ball FBGA
Package
Max
16.3
2.1
6
5
8
6
5
Min
–
–
–
–
–
209-ball FBGA
209-ball FBGA
Package
Max
15.2
1.7
6
5
8
6
5
Max
245
245
245
120
135
Page 23 of 36
°C/W
°C/W
Unit
Unit
Unit
mA
mA
mA
mA
mA
pF
pF
pF
pF
pF
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