CY7C1480BV33-250BZXC CYPRESS [Cypress Semiconductor], CY7C1480BV33-250BZXC Datasheet - Page 32

• Manufacturer Part Number: CY7C1480BV33-250BZXC
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document History Page
Document Number: 001-15145 Rev. *H
Document Title: CY7C1480BV33/CY7C1482BV33, 72-Mbit (2 M × 36/4 M × 18) Pipelined Sync SRAM
Document Number: 001-15145
Revision
*C
*D
*G
*H
*A
*B
*E
*F
**
1024385
2183566
2898663
2905654
3069168
3207715
3298193
3423864
3628180
ECN
KKVTMP
Orig. of
Change
VKN /
VKN /
PYRS
PRIT
PRIT
OSN
VKN
NJY
NJY
NJY
Submission
03/24/2010
06/04/2010
05/25/2012
03/28/2011
06/30/2011
10/27/2011
See ECN
See ECN
10/23/10
Date
New data sheet.
Changed status from Preliminary to Final.
Updated
in I
Updated
Information table).
Updated
Updated
CY7C1480BV33-167AXC, CY7C1480BV33-200BZXI from the ordering
information table).
Updated
available in Oracle PLM and therefore, it has been removed from the ordering
information list) and added
Updated
Updated
Updated in new template.
Updated
*C)).
Added
Updated in new template and styles to meet current CY standards.
Updated
Updated
Updated
(Corresponding to CY7C1482BV33), removed 209-ball FBGA package related
information).
Updated
information).
Removed Logic Block Diagram – CY7C1486BV33.
Updated
information (Corresponding to CY7C1482BV33), removed 209-ball FBGA
package related information).
Updated
Updated
information).
Updated
Removed Truth Table for Read/Write (Corresponding to CY7C1486BV33).
Updated
CY7C1486BV33 related information).
Updated
information).
Updated
Removed Boundary Scan Exit Order (Corresponding to CY7C1486BV33).
Updated
Updated
information).
Updated
information (spec 51-85167)).
DD
parameter).
Acronyms
Identification Register Definitions
Electrical Characteristics
Capacitance
Ordering Information
Package
Ordering Information
Ordering Information
Ordering
Package
Package Diagrams
Ordering
Package
Features
Functional Description
Pin Configurations
Pin
Functional Overview
Truth Table
IEEE 1149.1 Serial Boundary Scan (JTAG)
Scan Register Sizes
Thermal Resistance
Package Diagrams
Definitions.
and
Diagrams.
Information.
Diagrams.
Information.
Diagrams.
(Removed 100-pin TQFP package related information
(Removed CY7C1486BV33 related information).
(Removed 209-ball FBGA package related information).
Units of
Description of Change
Ordering Code
(Removed 100-pin TQFP package related
(spec 51-85165 (Changed revision from *B to
(Removed 209-ball FBGA package related
(Removed 209-ball FBGA package related
(Removed “Bit Size (× 72)” column).
(Removed CY7C1486BV33 related
(Removed inactive parts from Ordering
(Removed inactive parts
(The part CY7C1482BV33-200BZXC is not
Measure.
(Removed CY7C1486BV33 related
(Added Note
(Removed CY7C1486BV33 related
Definitions.
13
and referred the same note
CY7C1480BV33
CY7C1482BV33
(Removed
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