mfr4300 Freescale Semiconductor, Inc, mfr4300 Datasheet - Page 243

• Manufacturer Part Number: mfr4300
• Description: Flexray Communication Controllers
• Manufacturer: Freescale Semiconductor, Inc

1
2
3
4
5
6
A.1.9
This section describes the characteristics of all 3.3V I/O pins. All parameters are not always applicable,
e.g. not all pins feature pullup/pulldown resistances.
Freescale Semiconductor
Num
Num
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and EIA/JEDEC Standard 51-2 with the single layer horizontal PC Board according to EIA/JEDEC Standard
51-3
Per EIA/JEDEC Standard 51-6 with the four layer horizontal PC Board (double-sided PCB with two internal planes) according
to EIA/JEDEC Standard 51-7
Thermal resistance between the die and the printed circuit board per EIA/JEDEC Standard 51-8. Board temperature is
measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per EIA/JEDEC Standard 51-2.
1
2
3
4
5
1
2
3
4
5
6
7
Junction to Ambient LQFP64, single sided PCB
Junction to Ambient LQFP64, double sided PCB with 2 internal planes
Convection
Junction to Ambient LQFP64 (@200 ft/min), single sided PCB
Junction to Ambient LQFP64 (@200 ft/min), double sided PCB with 2 internal
planes
Junction to Board LQFP64
Junction to Case LQFP64
Junction to Package Top LQFP64
C
C
P
T
P
T
P
P
1,3
I/O Characteristics
Input High Voltage
Input High Voltage
Input Low Voltage
Input Low Voltage
Input Hysteresis
High Impedance (Off-state) Leakage Current
V
Output High Voltage (pins in output mode)
@50% Partial Drive I
IN
=V
DD
or V
SS
, all input/output and output pins
Conditions are shown in
5
4
Table A-5. Thermal Package Simulation Details
Table A-6. 5V I/O Characteristics (V
OH
Rating
= –2mA
6
, Natural Convection
Rating
MFR4300 Data Sheet, Rev. 3
1,2
, Natural Convection
Figure
A-4, unless otherwise noted.
Symbol
1,3
V
V
V
V
V
V
I
HYS
IN
OH
IH
IH
IL
IL
1,3
DD5
, Natural
0.65*V
V
V
DD5
SS5
= 5V)
–2.5
Min
—
—
—
–0.3
–0.8
DD5
Symbol
R
R
R
RTJA
R
R
Typ
250
<
TJMA
TJMA
TJMA
—
—
—
—
—
—
TJC
TJB
JT
Electrical Characteristics
0.35*V
V
DD5
Value
Max
+2.5
TBD
TBD
TBD
TBD
TBD
TBD
TBD
—
—
—
—
+0.3
DD5
o
o
o
o
o
o
o
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
mV
uA
V
V
V
V
V
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