tspc603r ATMEL Corporation, tspc603r Datasheet - Page 8

• Manufacturer Part Number: tspc603r
• Description: Powerpc 603e Risc Microprocessor Family Pid7t-603e
• Manufacturer: ATMEL Corporation

8.2
8.3
8
HiTCE CBGA Package
CERQUAD 240 Package
TSPC603R
Figure 8-1.
Assuming an air velocity of 1 m/sec, the associated overall thermal resistance and junction tem-
perature, found in
Table 8-1.
Vendors such as Aavid, Thermalloy
wide range of thermal performance.
Table 8-2.
Notes:
This section provides thermal management data for the 603R. This information is based on a
typical desktop configuration using a 240 lead, 32 mm x 32 mm, wire-bond CERQUAD package
with the cavity up (the silicon die is attached to the bottom of the package). This configuration
enables dissipation through the PCB.
The thermal characteristics for a wire-bond CERQUAD package are as follows:
Configuration
With 2328B heat sink
Characteristic
Junction-to-bottom of balls
Junction-to-ambient thermal resistance natural convection,
four-layer (2s2p) board
Junction to board thermal resistance
• Thermal resistance (junction to bottom of the case) (typical) = R
• Thermal resistance (junction to top of the case) is typically 16°C/W
Rsa (°C/W)
1. Simulation, no convection air flow.
2. Per JEDEC JESD51-2 with the board horizontal.
3. Per JEDEC JESD51-8 with the board horizontal.
CBGA Thermal Management Example
Thermal Resistance and Junction Temperature
HiTCE CBGA Package
Table 8-1
7
6
5
4
3
2
1
0
0
(1)
will result.
®
, and Wakefield Engineering can supply heat sinks with a
1
R
Approach Air Velocity (m/sec)
ja
(°C/W)
5
2
Symbol
R
R
θjc
R
θ
θ
θ
JMA
or θ
JB
J
jc
= 2.5°C/Watt
T
22.4
11.7
Value
j
106
7.5
(°C)
3
5410B–HIREL–09/05
(2)
(3)
°C/W
°C/W
°C/W
Unit