tspc603r ATMEL Corporation, tspc603r Datasheet - Page 52

• Manufacturer Part Number: tspc603r
• Description: Powerpc 603e Risc Microprocessor Family Pid7t-603e
• Manufacturer: ATMEL Corporation

15.4
Figure 15-4. Mechanical Dimensions of the Wire-bond CERQUAD Package
52
V
CERQUAD 240 Package
TSPC603R
Y
L
Die
C E
181
240
4 x 60 tips
W
180
1
0.16 T
U
L-N
H
TOP
M
Datum
Plane
M
S
A
HE
AB
View AE
Wire Bonds
View AE
AA
0.20
121
80
Θ2
K
Ceramic Body
M
Alloy 42 Leads
120
81
H L-N
T
H
VIEW AC
4 Places
0.10
Datum
Plane
Seating
Plane
N
S
M
S
B
Notes:
1. Dimensioning and tolerancing per ASMEY14.5M-1994
2. Controlling dimension: millimeter
3. Datum plane H is located at bottom of lead and
4. Datum L. M and N to be determined at datum plane H
5. Dimension S and V to be determined at seating plane T.
6. Dimension A and B define maximum ceramic body
is coincident with the lead where the lead exists the
ceramic body at the bottom of the parting line
dimensions including glass protrusion and top and
bottom mismatch
DIM
A
B
C
D
E
F
G
HE
J
K
P
S
U
V
W
Y
Z
AA
AB
Θ2
View AC
MILLIMETERS
MIN
30.86
30.86
3.67
0.185
3.10
0.175
2.025
0.130
0.45
34.41
17.20
34.41
0.45
17.20
0.122
1°
0.08
Z
X = L, M or N
Section AD
240 Places
M
AD
AD
TYP
31.00
31.00
3.95
0.220
3.50
0.200
0.50 BSC
2.100
0.147
0.50
0.25 BSC
34.58
17.30
34.58
0.70
17.30
0.127
1.80 REF
0.95 REF
4°
D
F
T L-N
G
X
S
J
M
MAX
31.75
31.75
4.15
0.270
3.90
0.225
2.175
0.175
0.55
34.75
17.40
34.75
0.95
17.40
0.132
7°
5410B–HIREL–09/05
P
S