tspc603r ATMEL Corporation, tspc603r Datasheet - Page 50

• Manufacturer Part Number: tspc603r
• Description: Powerpc 603e Risc Microprocessor Family Pid7t-603e
• Manufacturer: ATMEL Corporation

15.3
15.3.1
50
CI-CGA Package Parameters
TSPC603R
Mechanical Dimensions of the CI-CGA Package
The package parameters are as provided in the following list. The package type is 21 mm,
255-lead ceramic ball grid array (CI-CGA).
Figure 15-3
CGA package.
Package outline
Interconnects
Pitch
Typical module height
provides the mechanical dimensions and bottom surface nomenclature of the CI-
255
1.27 mm
21 mm × 21 mm
3.84 mm
5410B–HIREL–09/05