tspc603r ATMEL Corporation, tspc603r Datasheet - Page 2

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tspc603r

Manufacturer Part Number
tspc603r
Description
Powerpc 603e Risc Microprocessor Family Pid7t-603e
Manufacturer
ATMEL Corporation
Datasheet

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2. Screening/Quality/Packaging
2
TSPC603R
Ceramic Leaded Chip Carrier
CERQUAD 240
CERQUAD 240
Cavity up
A suffix
The 603R uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface
compatibility with TTL devices. It also integrates in-system testability and debugging features
through JTAG boundary-scan capabilities.
This product is manufactured in full compliance with:
• HiTCE CBGA according to Atmel Standards
• CI-CGA 255 and Cerquad: MIL-PRF-38535 class Q or according to Atmel standards
• CBGA 255: Upscreenings based upon Atmel standards
• CBGA, CI-CGA, HiTCE packages:
• Cerquad:
• Internal I/O Power Supply = 2.5 ±5% // 3.3V ±5%
– Full military temperature range (T
– Industrial temperature range
– Full military temperature range (T
– Industrial temperature range
– Commercial temperature ranges (
Ceramic Ball Grid Array
Ceramic Ball Grid Array
CBGA 255
HiTCE 255
GH suffix
G suffix
(T
(T
C
C
C
C
T
= -40°C, T
= -40°C, T
C
= -55°C, T
= -55°C, T
= 0°C,
T
C
j
c
j
c
= +110°C)
= +125°C)
= +110°C)
= +70°C)
= +125°C)
with Solder Column Interposer (SCI)
Ceramic Ball Grid Array
CI-CGA 255
GS suffix
5410B–HIREL–09/05

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