AD9251BCPZRL7 Analog Devices, Inc., AD9251BCPZRL7 Datasheet - Page 10

• Manufacturer Part Number: AD9251BCPZRL7
• Description: 14-bit, 20 Msps/40 Msps/65 Msps/80 Msps, 1.8 V Dual Analog-to-digital Converter
• Manufacturer: Analog Devices, Inc.

AD9251
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DRVDD to AGND
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CS to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OE to AGND
PDWN to AGND
D0A/D0B through D13A/D13B to
AGND
DCOA/DCOB to AGND
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. Pr A| Page 10 of 36
THERMAL CHARACTERISTICS
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered
customer’s circuit board
customer board also increases the reliability of the solder joints
and maximizes the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
64-Lead LFCSP
9 mm × 9 mm
(CP-64-5)
1
2
3
4
Typical θ
plane. As shown, airflow improves heat dissipation, which
reduces θ
leads from metal traces, through holes, ground, and power
planes, reduces the θ
ESD CAUTION
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
JA
JA
. In addition, metal in direct contact with the package
is specified for a 4-layer PCB with a solid ground
Airflow
Velocity (m/s)
0
1.0
2.0
Preliminary Technical Data
. Soldering the exposed paddle to the
JA
.
θ
TBD
TBD
TBD
JA
1, 2
to the AGND
θ
TBD
JC
1, 3
plane of the
θ
TBD
JB
1, 4
Unit
°C/W
°C/W
°C/W