AD6641 Analog Devices, AD6641 Datasheet - Page 10

• Manufacturer Part Number: AD6641
• Description: 250 MHz Bandwidth DPD Observation Receiver
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
AD6641
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
SPI_VDDIO to AVDD
SPI_VDDIO to DRVDD
PD[5:0]± to DRGND
PCLK± to DRGND
PDOR± to DRGND
FULL to DRGND
CLK± to AGND
FILL± to AGND
DUMP to AGND
EMPTY to AGND
VIN± to AGND
VREF to AGND
CML to AGND
CSB to DRGND
SP_SCLK, SP_SDFS to AGND
SDIO to DRGND
SP_SDO to DRGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
(Soldering, 10 sec)
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to SPI_VDDIO + 0.3 V
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to SPI_VDDIO + 0.3 V
−0.3 V to SPI_VDDIO + 0.3 V
−0.3 V to SPI_VDDIO + 0.3 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 10 of 28
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed pad must be soldered to the ground plane for
the LFCSP package. Soldering the exposed pad to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 7.
Package Type
56-Lead LFCSP_VQ (CP-56-1)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
ESD CAUTION
JA
.
JA
and θ
JC
are specified for a 4-layer board in still air.
θ
23.7
JA
θ
1.7
JC
Unit
°C/W
JA
. In