MCIMX27 Motorola Semiconductor Products, MCIMX27 Datasheet
MCIMX27
Manufacturer Part Number
MCIMX27
Description
Manufacturer
Motorola Semiconductor Products
Datasheet
1.MCIMX27.pdf
(118 pages)
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Freescale Semiconductor
Data Sheet, Advance Information
i.MX27 Data Sheet
Multimedia Applications
Processor
1
The i.MX27 (MCIMX27) Multimedia Applications
Processor represents the next step in low-power,
high-performance application processors.
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27 processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
The i.MX27 processor features the advanced and
power-efficient ARM926EJ-S core operating at speeds
up to 400 MHz, and is optimized for minimal power
consumption using the most advanced techniques for
power saving (for example, DPTC, power gating, and
This document contains information on a product under development. Freescale reserves the right to change or discontinue this
product without notice.
© Freescale Semiconductor, Inc., 2007. All rights reserved.
Preliminary—Subject to Change Without Notice
product. Specifications and information herein
This document contains information on a new
•
•
•
•
•
are subject to change without notice.
Introduction
Feature-rich cellular phones
Portable media players and mobile gaming
machines
Personal digital assistants (PDAs) and wireless
PDAs
Portable DVD players
Digital cameras
Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Functional Description and Application
3 Signal Descriptions . . . . . . . . . . . . . . . . . . . . 27
4 Package Information and Pinout . . . . . . . . 103
5 Product Documentation . . . . . . . . . . . . . . . 117
6 Revision History . . . . . . . . . . . . . . . . . . . . . 117
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Ordering Information . . . . . . . . . . . . . . . . . 4
Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 ARM926 Microprocessor Core Platform . . . 4
2.2 Module Inventory . . . . . . . . . . . . . . . . . . . . 5
2.3 Module Descriptions . . . . . . . . . . . . . . . . . . 9
3.1 Power-Up Sequence . . . . . . . . . . . . . . . . 36
3.2 EMI Pins Multiplexing . . . . . . . . . . . . . . . . 36
3.3 Electrical Characteristics . . . . . . . . . . . . . 41
3.4 i.MX27 Chip-Level Conditions . . . . . . . . . 41
3.5 Module-Level Electrical Specifications . . . 45
4.1 Full Package Outline Drawing . . . . . . . . 103
4.2 Pin Assignments . . . . . . . . . . . . . . . . . . . 104
See
Table 1 on page 4
Document Number: MCIMX27
Ordering Information
Package Information
i.MX27
(MAPBGA–404)
Plastic Package
Case 1816-01
for ordering information.
Rev. 0.1, 7/2007
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