MSC7115 Motorola Semiconductor Products, MSC7115 Datasheet - Page 18

• Manufacturer Part Number: MSC7115
• Manufacturer: Motorola Semiconductor Products

Specifications
2.2
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.3
Table 4 describes thermal characteristics of the MSC7115 for the MAP-BGA package.
Section 3.1, Thermal Design Considerations explains these characteristics in detail.
18
Core supply voltage
Memory supply voltage
PLL supply voltage
I/O supply voltage
Reference voltage
Operating temperature range
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board
Junction-to-case
Junction-to-package-top
Notes:
1.
2.
3.
4.
5.
6.
Recommended Operating Conditions
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
5
4
1, 2
Characteristic
6
MSC7115 Low-Cost 16-bit DSP with DDR Controller Data Sheet, Rev. 11
Table 4. Thermal Characteristics for MAP-BGA Package
Rating
1, 3
Table 3. Recommended Operating Conditions
Symbol
R
R
R
R
Ψ
θJA
θJA
θJB
θJC
JT
Convection
Symbol
Natural
MAP-BGA 17
V
V
V
V
V
DDPLL
DDIO
DDM
DDC
T
T
39
23
12
REF
7
2
A
J
(1 m/s) airflow
×
maximum: 105
minimum: –40
1.14 to 1.26
2.38 to 2.63
1.14 to 1.26
3.14 to 3.47
1.19 to 1.31
200 ft/min
17 mm
Value
31
20
Freescale Semiconductor
5
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
°C
°C
V
V
V
V
V