A43P26161 AMIC Technology, Corp., A43P26161 Datasheet - Page 12

• Manufacturer Part Number: A43P26161
• Description: 1M x 16-Bit x 4 Banks Low Power Synchronous DRAM
• Manufacturer: AMIC Technology, Corp.

Device Operations
Clock (CLK)
The clock input is used as the reference for all SDRAM
operations. All operations are synchronized to the positive
going edge of the clock. The clock transitions must be
monotonic between VIL and VIH. During operation with CKE
high all inputs are assumed to be in valid state (low or high)
for the duration of set up and hold time around positive edge
of the clock for proper functionality and ICC specifications.
Clock Enable (CKE)
The clock enable (CKE) gates the clock onto SDRAM. If
CKE goes low synchronously with clock (set-up and hold
time same as other inputs), the internal clock is suspended
from the next clock cycle and the state of output and burst
address is frozen as long as the CKE remains low. All other
inputs are ignored from the next clock cycle after CKE goes
low. When all banks are in the idle state and CKE goes low
synchronously with clock, the SDRAM enters the power
down mode from the next clock cycle. The SDRAM remains
in the power down mode ignoring the other inputs as long as
CKE remains low. The power down exit is synchronous as
the internal clock is suspended. When CKE goes high at
least “t
clock, then the SDRAM becomes active from the same clock
edge accepting all the input commands.
Bank Select (BS0, BS1)
This SDRAM is organized as 4 independent banks of
1,048,576 words X 16 bits memory arrays. The BS0, BS1
inputs is latched at the time of assertion of RAS and
to select the bank to be used for the operation. The bank
select BS0, BS1 is latched at bank activate, read, write
mode register set and precharge operations.
Address Input (A0 ~ A11)
The 20 address bits required to decode the 1,048,576 word
locations are multiplexed into 12 address input pins
(A0~A11). The 12 bit row address is latched along with
bit column address is latched along with
and BS1during read or write command.
NOP and Device Deselect
When RAS ,
performs no operation (NOP). NOP does not initiate any new
operation, but is needed to complete operations which
require more than single clock like bank activate, burst read,
auto refresh, etc. The device deselect is also a NOP and is
entered by asserting CS high. CS
command decoder so that RAS ,
the address inputs are ignored.
Power-Up
The following sequence is recommended for POWER UP
1. Power must be applied to either CKE and DQM inputs to
PRELIMINARY
RAS , BS0 and BS1 during bank activate command. The 8
pull them high and other pins are NOP condition at the
inputs before or along with VDD (and VDDQ) supply.
SS
+ 1
CLOCK
CAS
(July, 2005, Version 1.1)
” before the high going edge of the
and
WE
CAS
are high, the SDRAM
high disables the
and
CAS
WE
,
WE
, and all
CAS
, BS0
11
2. After VDD reaches the desired voltage, a minimum pause
3. All banks must be precharged now.
4. Perform a minimum of 2 Auto refresh cycles to stabilize
5. Perform a MODE REGISTER SET cycle to program the
Mode Register Set (MRS)
The mode register stores the data for controlling the various
operation modes of SDRAM. It programs the CAS latency,
addressing mode, burst length, test mode and various
vendor specific options to make SDRAM useful for variety of
different applications. The default value of the mode register
is not defined, therefore the mode register must be written
after power up to operate the SDRAM. The mode register is
written by asserting low on CS , RAS ,
SDRAM should be in active mode with CKE already high
prior to writing the mode register). The state of address pins
A0~A11,
mode register. One clock cycle is required to complete the
write in the mode register. The mode register contents can
be changed using the same command and clock cycle
requirements during operation as long as all banks are in the
idle state. The mode register is divided into various fields
depending on functionality. The burst length field uses
A0~A2, burst type uses A3, addressing mode uses A4~A6,
A7~A8, A9, BS0 and BS1 are used for vendor specific
options or test mode. And the write burst length is
programmed using A9. A7~A8, A10~A11, BS0 and BS1
must be set to low for normal SDRAM operation.
Refer to table for specific codes for various burst length,
addressing modes and CAS latencies. BS0 and BS1 have to
be set to “0” to enter the Mode Register.
Extended Mode Register (EMRS)
The Extended Mode Register controls functions beyond
those controlled by the Mode Register. These additional
functions are unique to AMIC’s Low Power SDRAM and
includes a Refresh Period field (TCSR) for temperature
compensated self-refresh and a Partial-Array Self Refresh
field (PASR). The PASR field is used to specify whether only
bank A and bank B,or bank A,or 1/2 of bank A,or 1/4 of bank
A be refreshed. Disable banks will not be refreshed in Self-
Refresh mode and written data will be lost. When only bank
A is selected it is possible to partial select only half or one
quarter of bank A. The TCR field has four entries to set
Refresh Period during self-refresh depending on the case
temperature of the Low Power devices.
The Extended Mode Register is programmed via the Mode
Register Set command (with BS0=0 and BS1=1) and retains
CS , RAS , CAS ,
The clock signal must also be asserted at the same time.
of 200 microseconds is required with inputs in NOP
condition.
the internal circuitry.
CAS latency, burst length and burst type as the default
value of mode register is undefined.
At the end of one clock cycle from the mode register set
cycle, the device is ready for operation.
When the above sequence is used for Power-up, all the
out-puts will be in high impedance state. The high
impedance of outputs is not guaranteed in any other
power-up sequence.
cf.) Sequence of 4 & 5 may be changed.
BS0
and
WE
going low is the data written in the
AMIC Technology, Corp.
BS1
in
the
A43P26161
same
CAS
,
cycle
WE
(The
as