LPC2926_27_29 NXP Semiconductors, LPC2926_27_29 Datasheet - Page 75
LPC2926_27_29
Manufacturer Part Number
LPC2926_27_29
Description
The LPC2926/2927/2929 combine an ARM968E-S CPU core with two integrated TCMblocks operating at frequencies of up to 125 MHz, Full-speed USB 2
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2926_27_29.pdf
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NXP Semiconductors
Table 38.
V
ground; positive currents flow into the IC; unless otherwise specified
[1]
[2]
[3]
LPC2926_27_29
Product data sheet
Symbol
t
f(o)
DD(CORE)
All parameters are guaranteed over the virtual junction temperature range by design. Pre-testing is performed at T
temperature on wafer level. Cased products are tested at T
test conditions to cover the specified temperature and power supply voltage range.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
= V
Dynamic characteristic: I
DD(OSC_PLL)
9.3 Dynamic characteristics: I
Parameter
output fall time
b
in pF, from 10 pF to 400 pF.
; V
DD(IO)
= 2.7 V to 3.6 V; V
2
C-bus pins
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 28 September 2010
DDA(ADC3V3)
Conditions
V
amb
IH
to V
= 25 °C (final testing). Both pre-testing and final testing use correlated
2
C-bus interface
= 3.0 V to 3.6 V; all voltages are measured with respect to
IL
[1]
ARM9 microcontroller with CAN, LIN, and USB
Min
20 + 0.1 × C
LPC2926/2927/2929
b
[3]
Typ
-
[2]
© NXP B.V. 2010. All rights reserved.
amb
Max
-
= 85 °C ambient
75 of 95
Unit
ns
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