AD9239 Analog Devices, AD9239 Datasheet - Page 8

• Manufacturer Part Number: AD9239
• Description: Quad, 12-Bit, 170 MSPS/210 MSPS/250 MSPS Serial Output 1.8 V ADC
• Manufacturer: Analog Devices

Specifications of AD9239

• Resolution (bits): 12bit
• # Chan: 4
• Sample Rate: 250MSPS
• Interface: Ser
• Analog Input Type: Diff-Uni,SE-Uni
• Ain Range: 1.25 V p-p
• Adc Architecture: Pipelined
• Pkg Type: CSP

AD9239
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Electrical
Environmental
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
DOUT ± x to DRGND
SDO, SDI/SDIO, CLK± , VIN ± x,
SCLK, CSB, PGMx, RESET,
Storage Temperature Range
Operating Temperature Range
Lead Temperature
Junction Temperature
VCMx, TEMPOUT, RBIAS to AGND
PDWN to AGND
(Soldering 10 sec)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. B | Page 8 of 40
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
72-Lead LFCSP (CP-72-3)
Typical θ
still air. Airflow increases heat dissipation, effectively reducing
θ
from metal traces and through holes, ground, and power planes
reduces the θ
ESD CAUTION
JA
. In addition, metal in direct contact with the package leads
JA
, θ
JB
JA
, and θ
.
JC
values are specified for a 4-layer board in
θ
16.2
JA
θ
7.9
JB
θ
0.6
JC
Unit
°C/W