SC28L201A1DGG,118 NXP Semiconductors, SC28L201A1DGG,118 Datasheet - Page 107

• Manufacturer Part Number: SC28L201A1DGG,118
• Description: IC UART W/FIFO 48-TSSOP
• Manufacturer: NXP Semiconductors
• Series: IMPACTr

Specifications of SC28L201A1DGG,118

• Features: False-start Bit Detection
• Number Of Channels: 2, DUART
• Fifo's: 256 Byte
• Voltage - Supply: 3.3V, 5V
• With Parallel Port: Yes
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• With Cmos: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935277824118; SC28L201A1DGG-T; SC28L201A1DGG-T

Philips Semiconductors
16. Abbreviations
17. Revision history
Table 85:
9397 750 13138
Product data sheet
Document ID
SC28L201_1
Revision history
Release date
20051031
[4]
[5]
[6]
[7]
[8]
[9]
Table 84:
Acronym
DMA
UART
FIFO
CPU
COS
BRG
MIDI
C/T
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Abbreviations
Data sheet status
Product data sheet
Description
Direct Memory Access
Universal Asynchronous Receiver/Transmitter
First In/First Out
Central Processing Unit
Change-Of-State
Baud Rate Generator
Musical Instrument Digital Interface
Counter/Timer
Rev. 01 — 31 October 2005
Change notice
3.3 V, 5 V UART, 3.125 Mbit/s, with 256-byte FIFO
Doc. number
9397 750 13138
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SC28L201
Supersedes
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