DS3170N+ Maxim Integrated Products, DS3170N+ Datasheet - Page 7

• Manufacturer Part Number: DS3170N+
• Description: IC TXRX DS3/E3 100-CSBGA
• Manufacturer: Maxim Integrated Products

Specifications of DS3170N+

• Function: Single-Chip Transceiver
• Interface: DS3, E3
• Number Of Circuits: 1
• Voltage - Supply: 3.135 V ~ 3.465 V
• Current - Supply: 120mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 100-LBGA
• Includes: DS3 Framers, E3 Framers, HDLC Controller, On-Chip BERTs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -

DS3170 DS3/E3 Single-Chip Transceiver
Figure 10-13. DS3 Frame Format ........................................................................................................................ 81
Figure 10-14. DS3 Subframe Framer State Diagram ............................................................................................ 81
Figure 10-15. DS3 Multiframe Framer State Diagram ........................................................................................... 82
Figure 10-16. G.751 E3 Frame Format ................................................................................................................. 89
Figure 10-17. G.832 E3 Frame Format ................................................................................................................. 92
Figure 10-18. MA Byte Format ............................................................................................................................. 92
Figure 10-19. HDLC Controller Block Diagram ..................................................................................................... 97
Figure 10-20. Trail Trace Controller Block Diagram ............................................................................................ 100
Figure 10-21. Trail Trace Byte (DT = Trail Trace Data) ....................................................................................... 102
Figure 10-22. FEAC Controller Block Diagram ................................................................................................... 103
Figure 10-23. FEAC Codeword Format .............................................................................................................. 104
Figure 10-24. Line Encoder/Decoder Block Diagram .......................................................................................... 105
Figure 10-25. B3ZS Signatures .......................................................................................................................... 107
Figure 10-26. HDB3 Signatures ......................................................................................................................... 107
Figure 10-27. BERT Block Diagram ................................................................................................................... 108
Figure 10-28. PRBS Synchronization State Diagram .......................................................................................... 110
Figure 10-29. Repetitive Pattern Synchronization State Diagram ........................................................................ 111
Figure 10-30. LIU Functional Diagram ................................................................................................................ 112
Figure 10-31. DS3/E3 LIU Block Diagram .......................................................................................................... 113
Figure 10-32. Receiver Jitter Tolerance .............................................................................................................. 116
Figure 13-1. JTAG Block Diagram ...................................................................................................................... 202
Figure 13-2. JTAG TAP Controller State Machine .............................................................................................. 203
Figure 13-3. JTAG Functional Timing ................................................................................................................. 207
Figure 14-1. DS3170 Pin Assignments—100-Ball CSBGA (Top View) ................................................................ 210
Figure 16-1. Clock Period and Duty Cycle Definitions ......................................................................................... 213
Figure 16-2. Rise Time, Fall Time, and Jitter Definitions ..................................................................................... 213
Figure 16-3. Hold, Setup, and Delay Definitions (Rising Clock Edge) .................................................................. 213
Figure 16-4. Hold, Setup, and Delay Definitions (Falling Clock Edge) ................................................................. 214
Figure 16-5. To/From Hi Z Delay Definitions (Rising Clock Edge) ....................................................................... 214
Figure 16-6. To/From Hi Z Delay Definitions (Falling Clock Edge) ...................................................................... 214
Figure 16-7. SPI Interface Timing Diagram ......................................................................................................... 218
Figure 16-8. Micro Interface Nonmultiplexed Read/Write Cycle .......................................................................... 220
Figure 16-9. Micro Interface Multiplexed Read Cycle .......................................................................................... 221
Figure 16-10. DS3 Pulse Mask Template ........................................................................................................... 223
Figure 16-11. E3 Waveform Template ................................................................................................................ 224
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