MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 5

• Manufacturer Part Number: MD3331-D64-V3-X
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD3331-D64-V3-X

• Density: 64MByte
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 69
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Programmable: Yes
• Lead Free Status / Rohs Status: Not Compliant

7. Register Descriptions ............................................................................................................. 35
8. Booting from Mobile DiskOnChip Plus ................................................................................. 42
9. Design Considerations ........................................................................................................... 45
5
6.1
6.2
6.3
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10 Interrupt Control................................................................................................................ 40
7.11 Toggle Bit Register ........................................................................................................... 41
8.1
8.2
8.3
9.1
9.2
General Description.......................................................................................................... 29
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
8KB Memory Window in Mobile DiskOnChip Plus 16MB ................................................. 33
8KB Memory Window for Mobile DiskOnChip Plus 32MB................................................ 34
Definition of Terms ........................................................................................................... 35
Reset Values .................................................................................................................... 35
Chip Identification (ID) Register........................................................................................ 36
No Operation (NOP) Register........................................................................................... 36
Test Register .................................................................................................................... 36
DiskOnChip Control Register/Control Confirmation Register ........................................... 37
Device ID Select Register................................................................................................. 38
Configuration Register...................................................................................................... 38
Output Control Register.................................................................................................... 39
Introduction....................................................................................................................... 42
Boot Procedure in PC-Compatible Platforms ................................................................... 42
Boot Replacement ............................................................................................................ 43
8.3.1
8.3.2
8.3.3
Design Environment ......................................................................................................... 45
System Interface............................................................................................................... 46
9.2.1
9.2.2
Built-In Operating System Support..................................................................................... 30
TrueFFS Software Development Kit (SDK)........................................................................ 30
File Management................................................................................................................ 30
Bad-Block Management ..................................................................................................... 30
Wear-Leveling .................................................................................................................... 30
Power Failure Management ............................................................................................... 31
Error Detection/Correction.................................................................................................. 31
Special Features through I/O Control (IOCTL) Mechanism ............................................... 32
Compatibility ....................................................................................................................... 32
PC Architectures ................................................................................................................ 43
Non-PC Architectures......................................................................................................... 44
Using Mobile DiskOnChip Plus in Asynchronous Boot Mode ............................................ 44
Standard Interface.............................................................................................................. 46
Multiplexed Interface .......................................................................................................... 47
Data Sheet, Rev. 1.8
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L