MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 4

• Manufacturer Part Number: MD3331-D64-V3-X
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD3331-D64-V3-X

• Density: 64MByte
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 69
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Programmable: Yes
• Lead Free Status / Rohs Status: Not Compliant

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1. Introduction ............................................................................................................................... 7
2. Product Overview ...................................................................................................................... 8
3. Theory of Operation ................................................................................................................ 18
4. Hardware Protection ............................................................................................................... 23
5. Modes of Operation................................................................................................................. 26
6. TrueFFS Technology............................................................................................................... 29
4
ABLE OF
2.1
2.2
2.3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 Flash Architecture............................................................................................................. 22
4.1
4.2
5.1
5.2
5.3
Product Description ............................................................................................................ 8
Standard Interface ............................................................................................................ 10
2.2.1
2.2.2
2.2.3
Multiplexed Interface ........................................................................................................ 14
2.3.1
2.3.2
2.3.3
Overview........................................................................................................................... 18
System Interface............................................................................................................... 19
Configuration Interface ..................................................................................................... 19
Protection and Security-Enabling Features ...................................................................... 19
3.4.1
3.4.2
3.4.3
Programmable Boot Block with eXecute In Place (XIP) Functionality.............................. 20
Download Engine (DE) ..................................................................................................... 21
Error Detection Code/Error Correction Code (EDC/ECC) ................................................ 21
Data Pipeline .................................................................................................................... 22
Control & Status ............................................................................................................... 22
Method of Operation......................................................................................................... 23
Low-Level Structure of the Protected Area....................................................................... 24
Normal Mode .................................................................................................................... 27
Reset Mode ...................................................................................................................... 27
Deep Power-Down Mode ................................................................................................. 27
C
ONTENTS
Ball Diagram ....................................................................................................................... 10
System Interface ................................................................................................................ 11
Signal Description .............................................................................................................. 12
Ball Diagram ....................................................................................................................... 14
System Interface ................................................................................................................ 15
Signal Description .............................................................................................................. 16
Read/Write Protection ........................................................................................................ 19
Unique Identification (UID) Number ................................................................................... 20
One-Time Programmable (OTP) Area ............................................................................... 20
Data Sheet, Rev. 1.8
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L