MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 2

• Manufacturer Part Number: MD3331-D64-V3-X
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD3331-D64-V3-X

• Density: 64MByte
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 69
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Programmable: Yes
• Lead Free Status / Rohs Status: Not Compliant

Boot Capability
Reliability
Hardware Compatibility
2
Programmable Boot Block with XIP
functionality to replace boot ROM:
Download Engine (DE) for automatic
download of boot code from Programmable
Boot Block
Boot capabilities:
Asynchronous Boot mode to boot CPUs that
wake up in burst mode
On-the-fly Reed-Solomon Error Detection
Code/Error Correction Code (EDC/ECC)
Guaranteed data integrity, even after power
failure
Transparent bad-block management
Dynamic and static wear-leveling
Configurable interface: simple SRAM-like
or multiplexed A/D interface
Compatible with all major CPUs, including:
8/16/32-bit bus architecture support
1KB for 16MB devices
2KB for 32MB devices
CPU initialization
Platform initialization
OS boot
ARM-based CPUs
Texas Instruments OMAP
Intel StrongARM/XScale
AMD Alchemy
Motorola PowerPC™ MPC8xx
Motorola DragonBall MX1
Philips PR31700
Hitachi SuperH™ SH-x
NEC VR Series
Data Sheet, Rev. 1.8
TrueFFS Software
Power Requirements
Capacities
Packaging
Full hard-disk read/write emulation for
transparent file system management
Identical software for all DiskOnChip
capacities
Patented methods to extend flash lifetime,
including:
Support for all major OS environments,
including:
Support for OS-less environments
8KByte memory window
Operating voltage
Current
16MB (128Mb) with device-cascading
option for up to 64MB (512Mb)
32MB (256Mb) with device cascading
option for up to 64MB (512Mb)
16MB: 69-ball FBGA: 9x12x1.2 mm (max)
32MB: 69-ball FBGA: 9x12x1.4 mm (max)
Dynamic virtual mapping
Dynamic and static wear-leveling
Symbian OS
Windows CE
Pocket PC
Smartphone
OSE
ATI Nucleus
Linux
Core: 2.5 to 3.6V
I/O (auto-detect):
1.65 - 1.95V or 2.5V - 3.6V
Active: 25 mA (Typ.)
Deep Power-Down (Typ.):
10 µA (16MB)
20 µA (32MB)
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L