STM32W108HBU64TR STMicroelectronics, STM32W108HBU64TR Datasheet - Page 205
STM32W108HBU64TR
Manufacturer Part Number
STM32W108HBU64TR
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32W108B-KEXT.pdf
(209 pages)
Specifications of STM32W108HBU64TR
Applications
RF4CE, Remote Control
Core Processor
ARM® Cortex-M3™
Program Memory Type
FLASH (128 kB)
Controller Series
STM32W
Ram Size
8K x 8
Interface
I²C, SPI, UART/USART
Number Of I /o
18
Voltage - Supply
1.18 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32W108HBU64TR
Manufacturer:
TDK
Quantity:
30 000
- Current page: 205 of 209
- Download datasheet (3Mb)
STM32W108CB, STM32W108HB
16
Ordering information scheme
1. This P/N is under specific ordering conditions. Please refer to your nearest ST sales office.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
Example:
Device family
STM32 = ARM-based 32-bit microcontroller
Product type
W = wireless system-on-chip
Sub-family
108 = IEEE 802.15.4 specification
Pin count
H = 40 pins
C = 48 pins
Code size
B = 128 Kbytes of Flash memory
Package
U = QFN
Temperature range
6 = –40 °C to +85 °C
Enabled protocol stack
“Blank” = Development sample platform
1 = Ember ZigBee stack
2 = ST ZigBee stack
3 = RF4CE stack
4 = IEEE 802.15.4 media access control
Doc ID 16252 Rev 8
(1)
STM32
W
Ordering information scheme
108
C
B
U
205/209
6
x
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