STM32W108HBU64TR STMicroelectronics, STM32W108HBU64TR Datasheet - Page 196
STM32W108HBU64TR
Manufacturer Part Number
STM32W108HBU64TR
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32W108B-KEXT.pdf
(209 pages)
Specifications of STM32W108HBU64TR
Applications
RF4CE, Remote Control
Core Processor
ARM® Cortex-M3™
Program Memory Type
FLASH (128 kB)
Controller Series
STM32W
Ram Size
8K x 8
Interface
I²C, SPI, UART/USART
Number Of I /o
18
Voltage - Supply
1.18 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
40-VFQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32W108HBU64TR
Manufacturer:
TDK
Quantity:
30 000
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Electrical characteristics
196/209
Table 52.
Total Tx current ( = I
MAC and baseband, CPU
Flash memory )
Parameter
DC electrical characteristics (continued)
Radio transmitter,
+ I
RAM, and
Doc ID 16252 Rev 8
VDD_PADS = 3.0 V, 25 °C;
maximum power setting
(+7 dBm); ARM
running at 12 MHz
VDD_PADS = 3.0 V, 25 °C;
+3 dBm power setting; ARM
Cortex-M3 running at 12 MHz
VDD_PADS = 3.0 V, 25 °C;
0dBm power setting; ARM
Cortex-M3 running at 12 MHz
VDD_PADS = 3.0 V, 25 °C;
minimum power setting; ARM
Cortex-M3 running at 12 MHz
VDD_PADS = 3.0 V, 25 °C;
maximum power setting
(+7 dBm); ARM
running at 24 MHz
VDD_PADS = 3.0 V, 25 °C;
+3 dBm power setting; ARM
Cortex-M3 running at 24 MHz
VDD_PADS = 3.0 V, 25 °C;
0dBm power setting; ARM
Cortex-M3 running at 24 MHz
VDD_PADS = 3.0 V, 25 °C;
minimum power setting; ARM
Cortex-M3 running at 24 MHz
Conditions
®
®
Cortex-M3
Cortex-M3
®
®
STM32W108CB, STM32W108HB
®
®
®
®
Min.
–
–
–
–
–
–
–
–
Typ.
42.0
29.5
27.0
21.0
43.5
31.0
28.5
22.5
Max.
–
–
–
–
–
–
–
–
Unit
mA
mA
mA
mA
mA
mA
mA
mA
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