PIC32MX675F512L-80V/BG Microchip Technology, PIC32MX675F512L-80V/BG Datasheet - Page 241
![512 KB Flash, 64 KB RAM, USB-OTG, Ethernet, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x](/photos/40/62/406286/landingpagemicrochippic32_sml.jpg)
PIC32MX675F512L-80V/BG
Manufacturer Part Number
PIC32MX675F512L-80V/BG
Description
512 KB Flash, 64 KB RAM, USB-OTG, Ethernet, 80 MHz, 10-Bit ADC, DMA 121 XBGA 10x
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Datasheet
1.PIC32MX575F256H-80VPT.pdf
(256 pages)
Specifications of PIC32MX675F512L-80V/BG
Processor Series
PIC32MX6xx
Core
MIPS
Data Bus Width
32 bit
Program Memory Type
Flash
Program Memory Size
512 KB
Data Ram Size
64 KB
Interface Type
USB, I2C, UART, RS-232, RS-485, SPI
Maximum Clock Frequency
80 MHz
Number Of Programmable I/os
5
Number Of Timers
5
Operating Supply Voltage
2.3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
XBGA-100
Operating Temperature Range
- 40 C to + 85 C
Supply Current (max)
10 mA
Core Processor
MIPS32® M4K™
Core Size
32-Bit
Speed
80MHz
Connectivity
Ethernet, I²C, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
-
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.3 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC32MX675F512L-80V/BG
Manufacturer:
Microchip Technology
Quantity:
10 000
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TABLE B-1:
© 2009-2011 Microchip Technology Inc.
4.0 “Memory Organization”
12.0 “I/O Ports”
22.0 “10-bit Analog-to-Digital
Converter (ADC)”
28.0 “Special Features”
31.0 “Electrical Characteristics”
32.0 “Packaging Information”
“Product Identification
Section Name
MAJOR SECTION UPDATES (CONTINUED)
System”
Updated all register tables to include the Virtual Address and All Resets
columns.
Updated the title of
Updated the title of
PIC32MX695F512H devices. Also changed PIC32MX795F512L to
PIC32MX795F512 H .
Updated the title of
Updated the title of
Updated the title of
Reversed the order of
Reversed the order of
Updated the title of
PIC32MX695F512L devices.
Updated the title of
Updated the title of
PIC32MX695F512L devices.
Updated the second paragraph of
12-1.
Updated the ADC Conversion Clock Period Block Diagram (see
Removed references to the ENVREG pin in
Regulator”
Updated the first sentence of
28.3.2 “On-Chip Regulator and BOR”
Updated the Connections for the On-Chip Regulator (see
Updated the Absolute Maximum Ratings and added Note 3.
Added Thermal Packaging Characteristics for the 121-pin XBGA package
(see
Updated the Operating Current (I
Updated the Idle Current (I
Updated the Power-Down Current (I
Removed Note 1 from the Program Flash Memory Wait State Characteristics
(see
Updated the SPIx Module Slave Mode (CKE = 1 ) Timing Characteristics,
changing SP52 to SP35 between the MSb and Bit 14 on SDOx (see
Figure
Added the 121-pin XBGA package marking information and package details.
Added the definition for BG (121-lead 10x10x1.1 mm, XBGA).
Added the definition for Speed.
Table
Table
31-13).
31-3).
31-12).
.
Figure 4-4
Figure 4-6
Table 4-3
Table 4-5
Table 4-6
Table 4-15
Table 4-45
Table 4-47
Table 4-11
Table 4-14
PIC32MX5XX/6XX/7XX
IDLE
Update Description
to include the PIC32MX695F512H device.
to include the PIC32MX575F5256L device.
to include the PIC32MX695F512L device.
28.3.1 “On-Chip Regulator and POR”
to include the PIC32MX575F256L device.
to include the PIC32MX695F512L and
to include the PIC32MX575F256L and
to include the PIC32MX575F256L device.
to include the PIC32MX695F512H and
) DC Characteristics (see
DD
and
and
12.1.2 “Digital Inputs”
) DC Characteristics (see
PD
Table
Table
) DC Characteristics (see
.
4-12.
4-15.
28.3 “On-Chip Voltage
Table
and removed Table
Figure
DS61156G-page 241
Table
31-6).
Figure
Table
28-2).
31-5).
and
31-7).
22-2).
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