PIC16F872-I/SP Microchip Technology Inc., PIC16F872-I/SP Datasheet - Page 154

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PIC16F872-I/SP

Manufacturer Part Number
PIC16F872-I/SP
Description
28 PIN, 7 KB FLASH, 128 RAM, 22 I/O
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of PIC16F872-I/SP

A/d Inputs
5-Channel, 10-Bit
Cpu Speed
5 MIPS
Eeprom Memory
64 Bytes
Input Output
22
Interface
I2C/SPI
Memory Type
Flash
Number Of Bits
8
Package Type
28-pin SPDIP
Programmable Memory
3.5K Bytes
Ram Size
128 Bytes
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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PIC16F872
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
DS30221C-page 152
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
n
p
A
E
L
B
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.430
.022
15
15
MIN
34.16
3.56
3.18
0.38
7.62
6.99
3.18
0.20
1.02
8.13
0.41
5
5
MILLIMETERS
© 2006 Microchip Technology Inc.
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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