PIC16F872-I/SP Microchip Technology Inc., PIC16F872-I/SP Datasheet - Page 125

• Manufacturer Part Number: PIC16F872-I/SP
• Description: 28 PIN, 7 KB FLASH, 128 RAM, 22 I/O
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F872-I/SP

• A/d Inputs: 5-Channel, 10-Bit
• Cpu Speed: 5 MIPS
• Eeprom Memory: 64 Bytes
• Input Output: 22
• Interface: I2C/SPI
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 28-pin SPDIP
• Programmable Memory: 3.5K Bytes
• Ram Size: 128 Bytes
• Speed: 20 MHz
• Timers: 2-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

14.3
© 2006 Microchip Technology Inc.
PIC16F872 (Extended)
D001
D001A
D001A
D002
D003
D004
D005
D020A
D021B
D023
Note 1: This is the limit to which V
Param
D010
D013
D015
No.
†
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through R
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from charac-
6: The
7: When BOR is enabled, the device will operate correctly until the V
DC Characteristics:
Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all I
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
terization and is for design guidance only. This is not tested.
added to the base I
V
V
V
S
V
I
I
Symbol
DD
PD
I
I
DD
DR
POR
VDD
BOR
BOR
BOR
current is the additional current consumed when this peripheral is enabled. This current should be
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
MCLR = V
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset
Voltage
Supply Current
Brown-out
Reset Current
Power-down
Current
Brown-out
Reset Current
DD
DD
Start Voltage to
Rise Rate to ensure
Characteristic/
(1)
(3,5)
DD
Device
DD
or I
; WDT enabled/disabled as specified.
PD
DD
(6)
(6)
DD
DD
(2,5)
PIC16F872 (Extended)
measurement.
can be lowered without losing RAM data.
measurements in active operation mode are:
/2R
EXT
(mA) with R
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
0.05
Min
4.0
4.5
3.7
BOR
—
—
—
—
—
—
EXT
Typ†
10.5
is not included. The current through the resistor can be esti-
V
1.5
4.0
1.6
1.5
85
85
—
—
7
SS
EXT
in kOhm.
Max
4.35
200
200
5.5
5.5
5.5
—
15
60
30
—
—
4
Units
V/ms See section on Power-on Reset for
-40°C
mA
mA
V
V
V
V
V
V
A
A
A
A
BOR
LP, XT, RC osc configuration
HS osc configuration
BOR enabled, F
See section on Power-on Reset for
details
details
BODEN bit in configuration word
enabled
RC osc configurations
F
HS osc configuration,
F
BOR enabled, V
V
V
BOR enabled, V
voltage trip point is reached.
OSC
OSC
DD
DD
T
A
= 4.0V, WDT enabled
= 4.0V, WDT disabled
= 4 MHz, V
= 20 MH
+125°C
PIC16F872
Conditions
Z
, V
MAX
DD
DD
DD
DS30221C-page 123
DD
DD
= 5.0V
= 5.0V
= 5.5V
= 14 MHz
DD
= 5.5V
and V
SS
(7)
.