MC68MH360EM33L Freescale Semiconductor, MC68MH360EM33L Datasheet - Page 814

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MC68MH360EM33L

Manufacturer Part Number
MC68MH360EM33L
Description
IC MPU QUICC ETHER 33MHZ 240FQFP
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC68MH360EM33L

Processor Type
M683xx 32-Bit
Speed
33MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
240-FQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC68MH360EM33L
Manufacturer:
MOTOLOLA
Quantity:
319
Part Number:
MC68MH360EM33L
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
10.2 THERMAL CHARACTERISTICS
10.3 POWER CONSIDERATIONS
The average chip-junction temperature, T J , in C can be obtained from:
For most applications, P I/O < 0.3*P INT and can be neglected.
An approximate relationship between P D and T J (if P I/O is neglected) is:
10-2
where:
T A =
P D =
PINT =
P I/O =
JA =
T J = T A + (P D • JA )
P D = K
Solving Equations (1) and (2) for K gives:
K = P D • (T A + 273 C) + JA • P D
Ambient Temperature, C
Package Thermal Resistance, Junction-to-Ambient, C/W
P INT + P I/O
I CC x V CC , Watts—Chip Internal Power
Power Dissipation on Input and Output Pins—User Determined
(T J + 273 C)
Thermal Resistance—Junction to Case
Thermal Resistance—Junction to Ambient
Thermal Resistance—Junction to Ambient
Notes:
1. Assumes natural convection and a single layer board (no thermal vias).
2. Assumes natural convection, a multi layer board with thermal vias
3. Assumes natural convection, a multi layer board with thermal vias
4. For more information on the design of thermal vias on multilayer boards and
68360 dissipation, and a board temperature rise of 30 C above ambient.
68360 dissipation, and a board temperature rise of 15 C above ambient.
BGA layout considerations in general, refer to AN-1231/D, “Plastic Ball Grid
Array Application Note” available from your local Motorola sales office.
T
J
= T
P
where:
240-Pin QFP
241-Pin PGA
357-Pin BGA
240-Pin QFP
241-Pin PGA
357-pin BGA
D
P
A
= (V
I/O
+ (P
Freescale Semiconductor, Inc.
is the power dissipation on pins.
DD
For More Information On This Product,
D
Characteristic
I
JA
DD
MC68360 USER’S MANUAL
)
) + P
Go to: www.freescale.com
I/O
2
Symbol
JC
JA
JA
Value
27.4
22.8
47
30
20
2
7
8
1
2
3
4
4
, 1.5 watt
,1.5 watt
Unit
C/W
C/W
C/W
MOTOROLA
(1)
(2)
(3)

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