MT46H32M16LFCK-10 Micron Technology Inc, MT46H32M16LFCK-10 Datasheet - Page 70

• Manufacturer Part Number: MT46H32M16LFCK-10
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M16LFCK-10

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Figure 39:
PDF: 09005aef818ff7c5/Source: 09005aef81a6c5f3
MT46H32M16LF_2..fm - Rev. F 09/05 EN
Data Input Timing
Notes: 1.
2.
3. WRITE command issued at TO.
4. For x16, LDQS controls the lower byte; UDQS controls the upper byte.
5. For x32, DQSO controls DQ[7:0], DQS1 controls DQ[15:8], DQS2 controls DQ[23:16], and
6. For x16, LDM controls the lower byte; UDM controls the upper byte.
7. For x32, DMO controls DQ[7:0], DM1 controls DQ[15:8], DM2 controls DQ[23:16], and DM3
DQS
DM
DQ
CK#
CK
t
t
DQS3 controls DQ[31:24].
controls DQ[31:24].
DSH (MIN) generally occurs during
DSS (MIN) generally occurs during
4
5
6
t
WPRES
T0
t
3
DQSS
t DS
T1
D
b
IN
t
WPRE
t
DSH
t DH
T1n
1
70
t
t
DQSL
DSS
2
T2
t
t
t
DQSS (MAX).
t
DQSH
DQSS (MIN).
DSH
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x16, x32 Mobile DDR SDRAM
T2n
1
TRANSITIONING DATA
DON’T CARE
t
t
WPST
DSS
2
T3
©2005 Micron Technology, Inc. All rights reserved.
Timing Diagrams
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