MT46H32M16LFCK-10 Micron Technology Inc, MT46H32M16LFCK-10 Datasheet - Page 49

• Manufacturer Part Number: MT46H32M16LFCK-10
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M16LFCK-10

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Figure 34:
Figure 35:
PDF: 09005aef818ff7c5/Source: 09005aef81a6c5f3
MT46H32M16LF_2..fm - Rev. F 09/05 EN
COMMAND
CKE
CK#
CK
Deep Power-Down Command
Deep Power-Down
All Banks idle with no
activity on the data bus
Notes: 1. Clock must be stable prior to CKE going HIGH.
NOP
T0
BA0, BA1
2. DPM = Deep power-down mode command; PRE ALL = Precharge all banks.
3. Upon exit of deep power-down mode, a PRECHARGE ALL command must be issued fol-
A0–A12
RAS#
CAS#
WE#
lowed by the initialization sequence (page 14).
CK#
CKE
CS#
CK
t
DPD
IS
T1
Enter deep power-down mode
2
T2
(
(
(
)
(
)
t
)
(
)
)
(
CKE
(
(
)
(
)
)
(
)
)
49
Ta0
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x16, x32 Mobile DDR SDRAM
NOP
Ta1
Exit deep power-down mode
Deep Power-Down (DPD)
T = 200µs
©2005 Micron Technology, Inc. All rights reserved.
Ta2
NOP
DON’T CARE
Vaild
Ta3
3
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