MT46H32M16LFCK-10 Micron Technology Inc, MT46H32M16LFCK-10 Datasheet - Page 49
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MT46H32M16LFCK-10
Manufacturer Part Number
MT46H32M16LFCK-10
Description
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H32M16LFCK-10.pdf
(81 pages)
Specifications of MT46H32M16LFCK-10
Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT46H32M16LFCK-10 L
Manufacturer:
MICRON
Quantity:
4 000
Figure 34:
Figure 35:
PDF: 09005aef818ff7c5/Source: 09005aef81a6c5f3
MT46H32M16LF_2..fm - Rev. F 09/05 EN
COMMAND
CKE
CK#
CK
Deep Power-Down Command
Deep Power-Down
All Banks idle with no
activity on the data bus
Notes: 1. Clock must be stable prior to CKE going HIGH.
NOP
T0
BA0, BA1
2. DPM = Deep power-down mode command; PRE ALL = Precharge all banks.
3. Upon exit of deep power-down mode, a PRECHARGE ALL command must be issued fol-
A0–A12
RAS#
CAS#
WE#
lowed by the initialization sequence (page 14).
CK#
CKE
CS#
CK
t
DPD
IS
T1
Enter deep power-down mode
2
T2
(
(
(
)
(
)
t
)
(
)
)
(
CKE
(
(
)
(
)
)
(
)
)
49
Ta0
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x16, x32 Mobile DDR SDRAM
NOP
Ta1
Exit deep power-down mode
Deep Power-Down (DPD)
T = 200µs
©2005 Micron Technology, Inc. All rights reserved.
Ta2
NOP
DON’T CARE
Vaild
Ta3
3
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