MT46H32M16LFCK-10 Micron Technology Inc, MT46H32M16LFCK-10 Datasheet - Page 14

• Manufacturer Part Number: MT46H32M16LFCK-10
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H32M16LFCK-10

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Functional Description
Initialization
PDF: 09005aef818ff7c5/Source: 09005aef81a6c5f3
MT46H32M16LF_2..fm - Rev. F 09/05 EN
1. To prevent device latch-up, the core power (V
2. Once power supply voltages are stable and the CKE has been driven HIGH, it is safe to
3. Once the clock is stable, a 200µs (minimum) delay is required by the Mobile DDR
4. Issue a PRECHARGE ALL command.
5. Issue NOP or DESELECT commands for at least
6. Issue an AUTO REFRESH command followed by NOP or DESELECT commands for at
The 512Mb Mobile DDR SDRAM is a high-speed CMOS, dynamic random-access mem-
ory containing 536,870,912 bits. It is internally configured as a quad-bank DRAM. Each
of the x16’s 134,217,728-bit banks is organized as 8,192 rows by 1K columns by 16 bits.
Each of the x32’s 134,217,728-bit banks is organized as 8,192 rows by 512 columns by 32
bits.
The 512Mb Mobile DDR SDRAM uses a double data rate architecture to achieve high-
speed operation. The double data rate architecture is essentially a 2n-prefetch architec-
ture, with an interface designed to transfer two data words per clock cycle at the I/O
balls. Single read or write access for the 512Mb Mobile DDR SDRAM consists of a single
2n-bit wide, one-clock-cycle data transfer at the internal DRAM core and two corre-
sponding n-bit wide, one-half-clock-cycle data transfers at the I/O balls.
Read and write accesses to the Mobile DDR SDRAM are burst oriented; accesses start at
a selected location and continue for a programmed number of locations in a pro-
grammed sequence. Accesses begin with the registration of an ACTIVE command, which
is then followed by a READ or WRITE command. The address bits registered coincident
with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1
select the bank; A0–A12 select the row). The address bits registered coincident with the
READ or WRITE command are used to select the starting column location for the burst
access.
It should be noted that the DLL signal that is typically used on standard DDR devices is
not necessary on the Mobile DDR SDRAM. It has been omitted to save power.
Prior to normal operation, the Mobile DDR SDRAM must be initialized. The following
sections provide detailed information covering device initialization, register definition,
command descriptions and device operation.
Mobile DDR SDRAMs must be powered up and initialized in a predefined manner. Oper-
ational procedures other than those specified may result in undefined operation.
If there is an interruption to the device power, the initialization routine should be fol-
lowed to ensure proper functionality of the Mobile DDR SDRAM. The clock stop feature
is not available until the device has been properly initialized.
To properly initialize the Mobile DDR SDRAM, the following 11 steps must be followed:
brought up simultaneously. It is recommended that V
power source. Assert and hold CKE HIGH.
apply the clock.
SDRAM prior to applying an executable command. During this time, NOP or DESE-
LECT commands must be issued on the command bus.
least
LECT commands for at least
AUTO REFRESH commands must be issued. Typically, both of these commands are
issued at this stage as described above. Alternately, the second AUTO-REFRESH com-
mand and NOP or DESELECT sequence can be issued between steps 10 and 11.
t
RFC time. Issue a second AUTO REFRESH command followed by NOP or DESE-
14
t
RFC time. As part of the initialization sequence, two
Micron Technology, Inc., reserves the right to change products or specifications without notice.
512Mb: x16, x32 Mobile DDR SDRAM
DD
t
RP time.
) and I/O power (V
DD
Functional Description
and V
©2005 Micron Technology, Inc. All rights reserved.
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